Instruction manual
ControlWave Micro Instruction Manual (CI-ControlWave Micro)
Revised May-2011 Index IND-5
Cables .......................................................... 2-27
configuration switch...................................... 2-22
RTD Input Module
Isolated......................................................... 3-45
wiring........................................................ 3-45
Run/Remote/Local switch................................... 4-2
Running diagnostic software............................. 5-16
S
SDRAM memory
amount............................................................ 1-7
Service Tools...................................................... 5-1
Site Considerations............................................. 2-1
Soft Switches
lock/unlock switch......................................... 2-21
use/ignore switch.......................................... 2-21
Software Tools.................................................. 1-10
Specifications
for temperature, humidty, vibration................. 2-2
SRAM memory
amount............................................................ 1-7
control switch................................................ 2-21
Switches
CPU.............................................................. 2-20
HART/BTI module ........................................ 3-59
Mode............................................................... 4-3
Run/Remote/Local.......................................... 4-2
System Firmware Downloader............................ 5-2
T
Tables
1-1. CPU Module Configurations.................... 1-5
2-1. PSSM Switch SW1................................ 2-13
2-2. Power Requirements............................. 2-14
2-3. CPU Module Switch SW1 ..................... 2-20
2-4. CPU Module Switch SW2 ..................... 2-21
2-5. RS-485 Configuration Siwtch................ 2-22
2-6. RS-232 Connectors on CPU................. 2-23
2-7. RS-232 Connectors on ECOM.............. 2-23
2-8. RS-232 Port Connector Pin Assignment2-24
2-9. RS-485 Connectors on CPU................. 2-27
2-10. CPU Board Connector Summary........ 2-27
2-11. RS-232 Connectors on ECOM............ 2-27
2-12. RS-485 Port Connector Pin Assignment. 2-
28
2-13. RS-485 Network Connections............. 2-28
2-14. Ethernet 10/100Base-T CPU Module Pin
Assignments............................................... 2-30
2-15. Radio Modem Setup Terminal Settings .. 2-
34
3-1. Isolated DI Module General Characteristics
...................................................................... 3-5
3-2. Isolated DI Module Configurations.......... 3-5
3-3. Jumper Assignments - Isolated DI Module3-
6
3-4. Isolated DO Module General Characteristics
.................................................................... 3-10
3-5. Isolated DO Module Configurations ...... 3-10
3-6. Jumper Assignments - Isolated DO Module
.................................................................... 3-11
3-7. Non-Isolated DI/DO Module General
Characteristics............................................ 3-14
3-8. Non-Isolated DI/O Module Configurations 3-
14
3-9. Jumper Assignments - Non-isolated DI/O
Module........................................................ 3-15
3-10. Non-Isolated AI/O and AI Module ....... 3-17
3-11. Non-Isolated AI/O Module Configurations
.................................................................... 3-18
3-12. Non
-Isolated AI Module Configurations .. 3-
18
3-13. Jumper Assignments - Non-isolated AI/O
and AI Module ............................................ 3-18
3-14. High Speed Counter Module General
Characteristics............................................ 3-21
3-15. High Speed Counter Module
Configurations ............................................ 3-21
3-16. Jumper Assignments - Non-isolated HSC
Module........................................................ 3-21
3-17. Isolated AI Module General Characteristics
.................................................................... 3-25
3-18. Isolated AI Module Configurations ...... 3-26
3-19. Jumper Assignments - Isolated AI Module
.................................................................... 3-26
3-20. Isolated AO Module Configurations .... 3-29
3-21. Jumper Assignments - Isolated AO Module
.................................................................... 3-29
3-22. Mixed I/O Module Configurations........ 3-32
3-23. Jumper Assignments - Non-isolated MI/O
Module........................................................ 3-33
3-24. Isolated Vac DI Module General
Characteristics............................................ 3-38
3-25. Jumper Assignments - Isolated Vac DI
Module........................................................ 3-38
3-26. Relay Isolated Vac/Vdc DO Module
Characteristics............................................ 3-40
3-27. Jumper Assignments - Isolated Vac DI
Module........................................................ 3-41
3-28. Isolated DI/O Module Characteristics.. 3-42
3-29. Jumper Assignments - Isolated Vac DI
Module........................................................ 3-43
3-30. Isolated RTD Input Module General
Characteristics............................................ 3-45
3-31. Isolated RTD Input Module Configurations
.................................................................... 3-45
3-32. Isolated LLAI Module Characteristics.. 3-48
3-33. Isolated LLAI Module Configurations.. 3-48
3-34. LLAI Module Input Accuracy and
Resolution................................................... 3-50
3-35. LLAI Module RTD Error with CJC at 25C
.................................................................... 3-51
3-36. Non-isolated HART/BTI Interface Module3-
55
3-37. HART/BTI TB1 and TB2 Wiring
Connections – Local Termination............... 3-55