User's Manual

USER MANUA

V0.82

TCM 300 / 300C / 320 / 320C

3 .7 Soldering inform a t ion

3 .7 .1 TCM 3 0 0 / TCM 3 0 0 C

TCM 300 has to be soldered according to IPC/JEDEC J-STD-020C standard.

TCM 300 shall be handled according to Moisture Sensitivity Level MSL4 which means a floor

time of 72 h. TCM 300 may be soldered only once, since one time is already consumed at

production of the module itself.

Once the dry pack bag is opened, the desired quantity of units should be removed and the

bag resealed within two hours. If the bag is left open longer than 30 minutes the desiccant

should be replaced with dry desiccant. If devices have exceeded the specified floor life time

of 72 h, they may be baked according IPC/JEDEC J-STD-033B.

Devices packaged in moisture-proof packaging should be stored in ambient conditions not

exceeding temperatures of 40 °C or humidity levels of 90% r.H.

TCM 300 modules have to be soldered within 6 months after delivery!