User's Manual

USER MANUAL

TCM 300 / TCM 300C / TCM 300U

TCM 320 / TCM 320C / TCM 320U

4.7 Soldering information

4.7.1 TCM 300x

TCM 300x has to be soldered according to IPC/JEDEC J-STD-020C standard.

TCM 300x shall be handled according to Moisture Sensitivity Level MSL4 which means a

floor time of 72 h. TCM 300 may be soldered only once, since one time is already consumed

at production of the module itself.

Once the dry pack bag is opened, the desired quantity of units should be removed and the

bag resealed within two hours. If the bag is left open longer than 30 minutes the desiccant

should be replaced with dry desiccant. If devices have exceeded the specified floor life time

of 72 h, they may be baked according IPC/JEDEC J-STD-033B at max. 90 °C for less than

60 h.

Devices packaged in moisture-proof packaging should be stored in ambient conditions not

exceeding temperatures of 40 °C or humidity levels of 90% r.H.

TCM 300x modules have to be soldered within 6 months after delivery!