Film Capacitors EMI Suppression Capacitors (MKP) Series/Type: B32021 ... B32026 Date: November 2019 © TDK Electronics AG 2019. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without TDK Electronics' prior express consent is prohibited.
EMI suppression capacitors (MKP) B32021 ... B32026 Y2 / 300 V AC Typical applications Y2 class for interference suppression "Line to ground" applications. Dimensional drawing Climatic Max.
B32021 ... B32026 Y2 / 300 V AC Approvals Approval Standards marks EN 60384-14:2014 IEC 60384-14:2013 UL 1414:2000 UL 1283:2005 CSA C22.2 No.1:2004 CSA C22.2 No.8:2013 UL 60384-14:2014 CSA E60384-14:2013 Notes: Certificate 40018909 E97863 / E157153 E97863 / E157153 (approved by UL) E97863 (approved by UL) Effective January 2014, only for EMI supression capacitors: UL 60384-14:2014 certification replaces both UL 1414:2000 and UL 1283:2005 standards. CSA C22.2 No.1.2004 and CSA C22.2 No.
B32021 ... B32026 Y2 / 300 V AC Overview of available types Lead spacing 10 mm 15 mm 22.5 mm 27.5 mm 37.5 mm Type B32022 B32023 B32024 B32026 B32021 CR (μF) 0.0010 0.0015 0.0022 0.0033 0.0047 0.0056 0.0068 0.0082 0.010 0.015 0.022 0.033 0.047 0.056 0.068 0.082 0.10 0.15 0.22 0.33 0.39 0.47 0.56 0.68 0.82 1.0 Please read Cautions and warnings and Important notes at the end of this document.
B32021 ... B32026 Y2 / 300 V AC Ordering codes and packing units Lead spacing CR mm 10 15 μF 0.0010 0.0015 0.0022 0.0033 0.0047 0.0056 0.0068 0.0082 0.010 0.010 0.015 0.022 0.022 0.033 0.047 0.047 0.056 0.068 0.082 Max. dimensions w×h×l mm 4.0 × 9.0 × 13.0 4.0 × 9.0 × 13.0 4.0 × 9.0 × 13.0 4.0 × 9.0 × 13.0 5.0 × 11.0 × 13.0 5.0 × 11.0 × 13.0 5.0 × 11.0 × 13.0 6.0 × 12.0 × 13.0 6.0 × 12.0 × 13.0 5.0 × 10.5 × 18.0 6.0 × 11.0 × 18.0 6.0 × 12.0 × 18.0 7.0 × 12.5 × 18.0 8.0 × 14.0 × 18.0 8.5 × 14.5 × 18.0 9.
B32021 ... B32026 Y2 / 300 V AC Ordering codes and packing units Lead spacing CR mm 22.5 27.5 μF 0.047 0.056 0.068 0.068 0.082 0.10 0.10 0.15 0.15 0.22 0.22 0.33 0.39 0.15 0.22 0.22 0.33 0.33 0.47 0.47 Max. dimensions w×h×l mm 6.0 × 15.0 × 26.5 6.0 × 15.0 × 26.5 7.0 × 16.0 × 26.5 7.5 × 14.5 × 26.5 8.5 × 16.5 × 26.5 8.5 × 16.5 × 26.5 10.5 × 16.5 × 26.5 10.5 × 18.5 × 26.5 10.5 × 20.5 × 26.5 12.0 × 22.0 × 26.5 14.5 × 29.5 × 26.5 14.5 × 29.5 × 26.5 14.5 × 29.5 × 26.5 11.0 × 19.0 × 31.5 11.0 × 19.0 × 31.
B32021 ... B32026 Y2 / 300 V AC Ordering codes and packing units Lead spacing CR mm 27.5 37.5 μF 0.47 0.56 0.68 0.68 0.68 0.82 1.0 0.33 0.47 0.56 0.56 0.68 0.82 0.82 1.0 1.0 Max. dimensions w×h×l mm 18.0 × 27.5 × 31.5 16.0 × 32.0 × 31.5 18.0 × 33.0 × 31.5 19.0 × 30.0 × 31.5 21.0 × 31.0 × 31.5 22.0 × 36.5 × 31.5 22.0 × 36.5 × 31.5 12.0 × 22.0 × 41.5 14.0 × 25.0 × 41.5 14.0 × 25.0 × 41.5 16.0 × 28.5 × 41.5 16.0 × 28.5 × 41.5 16.0 × 28.5 × 41.5 18.0 × 32.5 × 41.5 18.0 × 32.5 × 41.5 20.0 × 39.5 × 42.
B32021 ... B32026 Y2 / 300 V AC Technical data Reference standard: IEC 60384-14:2013. All data given at T = 20 °C, unless otherwise specified. Rated AC voltage (IEC 60384-14:2013) 300 V (50/60 Hz) Maximum continuous DC voltage VDC 1500 V Maximum continuous AC voltage VAC 480 V (50/60 Hz) Max. operating temperature Top,max +110 °C DC test voltage 4000 V (C ≤ 0.33 μF), 3700 V (C > 0.33 μF), 2 s The repetition of this DC voltage test may damage the capacitor.
B32021 ... B32026 Y2 / 300 V AC Testing and Standards Test Reference Conditions of test Electrical IEC parameters 60384-14:2013 Voltage Proof: Between terminals, 1500 V AC, 1 min. Terminals and enclosure: 2 VR + 1500 V AC Insulation resistance, Rins Capacitance, C Dissipation factor, tan δ Robustness IEC Tensile strength (test Ua1) of termina- 60068-2-21:2006 Wire diameter Tensile tions force 0.5 < d1 ≤ 0.8 mm 10 N 0.8 < d1 ≤ 1.
B32021 ... B32026 Y2 / 300 V AC Test Reference Damp heat, IEC steady 60384-14:2013 state Impulse test Endurance IEC 60384-14:2013 Conditions of test Test Ca 40 °C / 93% RH / 56 days 3 impulses Tb / 1.7 VR / 1000 hours, 1000 VRMS for 0.1 s every hour Performance requirements No visible damage ΔC/C0 ≤ 5% Δ tan δ ≤ 0.008 for C ≤ 1 μF Δ tan δ ≤ 0.005 for C > 1 μF Voltage proof Rins ≥ 50% of initial limit No visible damage ΔC/C0 ≤ 10% Δ tan δ ≤ 0.008 for C ≤ 1 μF Δ tan δ ≤ 0.
B32021 ... B32026 Y2 / 300 V AC Mounting guidelines 1 Soldering 1.1 Solderability of leads The solderability of terminal leads is tested to IEC 60068-2-20:2008, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2:2007, test Ba: 4 h exposure to dry heat at 155 °C).
B32021 ... B32026 Y2 / 300 V AC Immersion depth 2.0 +0/ 0.5 mm from capacitor body or seating plane Shield Heat-absorbing board, (1.5 ±0.5) mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection ΔC/C0 tan δ 1.3 No visible damage 2% for MKT/MKP/MFP 5% for EMI suppression capacitors As specified in sectional specification General notes on soldering Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature Tmax.
B32021 ... B32026 Y2 / 300 V AC The overheating associated with some of these factors can usually be reduced by suitable countermeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. Recommendations As a reference, the recommended wave soldering profile for our film capacitors is as follows: Please read Cautions and warnings and Important notes at the end of this document.
B32021 ... B32026 Y2 / 300 V AC Body temperature should follow the description below: MKP capacitor During pre-heating: Tp ≤110 °C During soldering: Ts ≤120 °C, ts ≤45 s MKT capacitor During pre-heating: Tp ≤125 °C During soldering: Ts ≤160 °C, ts ≤45 s When SMD components are used together with leaded ones, the film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step. Leaded film capacitors are not suitable for reflow soldering.
B32021 ... B32026 Y2 / 300 V AC Please read Cautions and warnings and Important notes at the end of this document.
B32021 ... B32026 Y2 / 300 V AC Cautions and warnings Do not exceed the upper category temperature (UCT). Do not apply any mechanical stress to the capacitor terminals. Avoid any compressive, tensile or flexural stress. Do not move the capacitor after it has been soldered to the PC board. Do not pick up the PC board by the soldered capacitor. Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing.
B32021 ... B32026 Y2 / 300 V AC Topic Safety information Soldering Do not exceed the specified time or temperature limits during soldering. Use only suitable solvents for cleaning capacitors. When embedding finished circuit assemblies in plastic resins, chemical and thermal influences must be taken into account.
B32021 ... B32026 Y2 / 300 V AC ing codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.tdk-electronics.tdk.com/orderingcodes. Please read Cautions and warnings and Important notes at the end of this document.
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Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned.
Important notes 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements (“CSR”) TDK always has and will continue to have the policy of respecting individual agreements.