NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 5 mm Series/Type: B57164K Date: January 2018 © EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. EPCOS AG is a TDK Group Company.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm Applications Temperature measurement and compensation K164 Dimensional drawing Features Wide resistance range Cost-effective Lacquer-coated thermistor disk Tinned copper leads Lead spacing 5 mm Marked with resistance and tolerance Delivery mode Bulk (standard), cardboard tape, reeled or in Ammo pack on request Dimensions in mm Approx. weight 370 mg General technical data Climatic category Max.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 Electrical specification and ordering codes R25 Ω 22 33 47 68 100 150 220 330 470 680 1k 1.5 k 2.2 k 3.3 k 4.7 k 6.8 k 10 k 15 k 22 k 33 k 47 k 68 k 100 k 150 k 220 k 330 k 470 k No.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 Reliability data Test Standard Storage in dry heat IEC 60068-2-2 Storage in damp heat, steady state Rapid temperature cycling Endurance Long-term stability (empirical value) Test conditions Storage at upper category temperature T: 125 °C t: 1000 h IEC Temperature of air: 40 °C 60068-2-78 Relative humidity of air: 93% Duration: 21 days IEC Lower test temperature: 55 °C 60068-2-14 Upper test temperature:
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 R/T characteristics R/T No. T (°C) 1011 1012 1013 B25/100 = 3730 K B25/100 = 4300 K B25/100 = 3900 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 70.014 49.906 36.015 26.296 19.411 6.9 6.7 6.4 6.2 6.0 87.237 62.264 44.854 32.599 23.893 6.8 6.7 6.5 6.3 6.1 77.285 54.938 39.507 28.722 21.099 7.0 6.7 6.5 6.3 6.1 30.0 25.0 20.0 15.0 10.0 14.479 10.903 8.2923 6.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 R/T characteristics R/T No. T (°C) 1014 1203 1302 B25/100 = 4250 K B25/100 = 2900 K B25/100 = 3000 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 83.935 60.228 43.593 31.815 23.404 6.8 6.6 6.4 6.3 6.1 30.0 25.0 20.0 15.0 10.0 17.349 12.946 9.7439 7.3737 5.6247 6.0 5.8 5.7 5.5 5.4 8.4216 6.7001 5.3757 4.3443 3.5376 4.7 4.5 4.3 4.2 4.1 8.9067 7.0357 5.6065 4.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 R/T characteristics R/T No. T (°C) 55.0 50.0 45.0 40.0 35.0 1303 1305 1306 B25/100 = 3050 K B25/100 = 3200 K B25/100 = 3450 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 34.363 25.827 19.635 15.089 11.712 5.8 5.6 5.4 5.2 5.0 42.131 31.129 23.273 17.592 13.438 6.2 5.9 5.7 5.5 5.3 49.935 36.64 27.18 20.37 15.416 6.3 6.1 5.9 5.7 5.5 30.0 25.0 20.0 15.0 10.0 9.1774 7.2552 5.7835 4.6467 3.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 R/T characteristics R/T No. T (°C) 1307 2005 2006 B25/100 = 3560 K B25/100 = 4600 K B25/100 = 5000 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 51.115 38.3 28.847 21.842 16.627 5.7 5.7 5.6 5.5 5.4 30.0 25.0 20.0 15.0 10.0 12.725 9.7859 7.5902 5.8918 4.6124 5.3 5.2 5.1 5.0 4.8 22.746 16.49 12.071 8.8455 6.5446 6.6 6.4 6.3 6.1 6.0 28.272 19.997 14.292 10.35 7.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 R/T characteristics R/T No. T (°C) 55.0 50.0 45.0 40.0 35.0 2007 2903 2904 B25/100 = 4830 K B25/100 = 4200 K B25/100 = 4300 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 185.87 123.23 82.888 56.544 39.061 8.4 8.1 7.8 7.6 7.3 120.03 82.38 57.248 40.255 28.627 7.7 7.4 7.2 7.0 6.7 121.46 84.439 59.243 41.938 29.947 7.4 7.2 7.1 6.9 6.7 30.0 25.0 20.0 15.0 10.0 27.321 19.326 13.823 10.001 7.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 R/T characteristics R/T No. T (°C) 4001 4003 B25/100 = 3950 K B25/100 = 4450 K RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 88.052 61.65 43.727 31.395 22.802 7.3 7.0 6.8 6.5 6.3 30.0 25.0 20.0 15.0 10.0 16.742 12.367 9.2353 7.0079 5.3654 6.2 6.0 5.6 5.4 5.4 20.142 14.801 10.976 8.1744 6.1407 6.2 6.1 5.9 5.8 5.7 5.0 0.0 5.0 10.0 15.0 4.126 3.2 2.4986 1.9662 1.5596 5.2 5.0 4.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 Taping and packing 1 Taping of SMD NTC thermistors Tape and reel packing according to IEC 60286-3. Tape material: Cardboard or blister, tape width 8 ±0.30 mm 2 Reel packing Dimensions in mm 8-mm tape 180-mm reel 330-mm reel A 180 +0/ 3 330 +0/ 2.0 W1 8.4 +1.5/ 0 8.4 +1.5/ 0 W2 14.4 max. 14.4 max. Leader, trailer Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 Packing units for discrete chip Case size Chip thickness inch/mm 0402/1005 0603/1608 0805/2012 1206/3216 3 th 0.5 mm 0.8 mm 0.8 mm 1.2 mm 0.8 mm 1.2 mm Cardboard tape Blister tape W 8 mm 8 mm W 8 mm 8 mm 8 mm 8 mm 8 mm ∅ 180-mm reel ∅ 330-mm reel pcs. 10000 4000 2000/ 4000 3000 2000 4000 pcs.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm 4 K164 Taping of radial leaded NTC thermistors Dimensions and tolerances Lead spacing F = 2.5 mm and 5.0 mm (taping to IEC 60286-2) Dimensions (mm) w th d P0 P1 F ∆h ∆p W W0 W1 W2 H H0 H1 D0 t L L1 Lead spacing 2.5 mm 11.0 5.0 0.5/0.6 12.7 5.1 2.5 0 0 18.0 5.5 9.0 3.0 18.0 16.0 32.2 4.0 0.9 11.0 4.0 Lead spacing 5 mm 11.5 6.0 0.5/0.6 12.7 3.85 5.0 0 0 18.0 5.5 9.0 3.0 18.0 16.0 32.2 4.0 0.9 11.0 4.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 Types of packing Ammo packing Ammo type x y z I 80 240 210 Packing unit: 1000 - 2000 pcs./reel Reel packing Packing unit: 1000 - 2000 pcs./reel Reel dimensions (in mm) Reel type d f n w I 360 max. 31 ±1 approx. 45 54 max. Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement and compensation Leaded NTC thermistors, lead spacing 5 mm B57164K K164 Cassette packing Packing unit: 1000 - 2000 pcs./cassette Bulk packing The components are packed in cardboard boxes, the size of which depends on the order quantity. Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm 5 K164 Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 00, 01, 02, 03,04, 05, 06, 07, 08 Bulk 40, 41 Bulk 45 Bulk 50 Radial leads, kinked Cardboard tape Cassette packing 51 Radial leads, kinked Cardboard tape 360-mm reel packing 52 Radial leads, straight Cardboard tape Cassette packing 53 Radial leads, straight Cardboar
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 Mounting instructions 1 Soldering 1.1 Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Bath temperature Dip soldering Iron soldering max. 260 °C max.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 should be used. In addition, soldering methods should be employed which permit short soldering times. 1.3 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The use of no-clean solder products is recommended. In any case mild, non-activated fluxes should be used. Flux residues after soldering should be minimized.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm 1.3.1 K164 Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.3.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm Profile feature Preheat and soak - Temperature min - Temperature max - Time K164 Sn-Pb eutectic assembly Pb-free assembly Tsmin Tsmax tsmin to tsmax 100 °C 150 °C 60 ... 120 s 150 °C 200 °C 60 ... 120 s Average ramp-up rate Tsmax to Tp 3 °C/ s max. 3 °C/ s max. Liquidous temperature Time at liquidous TL tL 183 °C 40 ... 150 s 217 °C 40 ... 150 s Peak package body temperature Tp 215 °C ...
Temperature measurement and compensation Leaded NTC thermistors, lead spacing 5 mm 1.3.4 B57164K K164 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 2 Conductive adhesion An alternative to soldering for silver-palladium terminated components is the gluing of thermistors with conductive adhesives.
Temperature measurement and compensation Leaded NTC thermistors, lead spacing 5 mm Tensile strength: B57164K K164 Test Ua1: Value of applied force for Ua1 test: Diameter (d) of Force with tolerance of ±10% corresponding round leads ∅ ≤ 0.25 mm 1.0 N 0.25 < ∅ ≤ 0.35 mm 2.5 N 0.35 < ∅ ≤ 0.50 mm 5.0 N 0.50 < ∅ ≤ 0.80 mm 10.
Temperature measurement and compensation Leaded NTC thermistors, lead spacing 5 mm 5 B57164K K164 Sealing and potting Sealing or potting processes can affect the reliability of the component. When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm 8 K164 Placement and orientation of SMD NTC thermistors on PCB a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked.
Temperature measurement and compensation Leaded NTC thermistors, lead spacing 5 mm B57164K K164 Cautions and warnings General See "Important notes" on page 2. Storage Store thermistors only in original packaging. Do not open the package prior to processing. Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible.
Temperature measurement and compensation Leaded NTC thermistors, lead spacing 5 mm B57164K K164 Mounting Ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. The maximum temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral.
Temperature measurement and compensation Leaded NTC thermistors, lead spacing 5 mm B57164K K164 sheets, data books, other publications, on the EPCOS website, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 Symbols and terms Symbol English German A AWG Area American Wire Gauge Fläche Amerikanische Norm für Drahtquerschnitte B B25/100 B value B value determined by resistance measurement at 25 °C and 100 °C B-Wert B-Wert, ermittelt durch Widerstandsmessungen bei 25 °C und 100 °C Cth Heat capacitance Wärmekapazität I Current Strom N Number (integer) Anzahl (ganzzahliger Wert) P25 Pdiss Pel Pmax M
Temperature measurement and compensation B57164K Leaded NTC thermistors, lead spacing 5 mm K164 Symbol English German α Temperature coefficient Temperaturkoeffizient ∆ Tolerance, change Toleranz, Änderung δth Dissipation factor Wärmeleitwert τc τa Thermal cooling time constant Thermal time constant Thermische Abkühlzeitkonstante Thermische Zeitkonstante Abbreviations / Notes Symbol English German Surface-mounted devices Oberflächenmontierbares Bauelement * To be replaced by a number
Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned.
Important notes 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.
