Datasheet

Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test Standard Test conditions ∆R
25
/R
25
(typical)
Remarks
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ±2) °C
t: 1000 h
< 2%
Storage in damp
heat, steady state
IEC
60068-2-78
JIS C 0022
Temperature of air: (40 ±2) °C
Relative humidity of air:
(93 +2/3)%
Duration: 56 days
1)
< 2%
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: 55 °C
Upper test temperature: 125 °C
Number of cycles: 100
2)
< 2%
Endurance P
max
: 180 mW
T: (65 ±2) °C
t: 1000 h
< 2%
Solderability IEC
60068-2-58
JIS C 0054
Solderability:
(215 ±3) °C, (3 ±0.3) s
(245 ±5) °C, (3 ±0.3) s
Resistance to soldering heat:
(260 ±5) °C, (10 ±1) s
95% of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
< 1%
Temperature measurement and compensation B573**V2
SMD NTC thermistors, case size 0603 (1608) Standard series
Page 4 of 21Please read Cautions and warnings and
Important notes at the end of this document.