Datasheet

Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test Standard Test conditions ∆R
25
/R
25
(typical)
Remarks
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ±2) °C
t: 1000 h
< 2%
1)
Storage in damp
heat, steady state
IEC
60068-2-78
JIS C 0022
Temperature of air: (40 ±2) °C
Relative humidity of air:
(93 +2/3)%
Duration: 56 days
2)
< 2%
2)
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: 55 °C
Upper test temperature: 125 °C
Number of cycles: 100
3)
< 2%
3)
Endurance P
max
: 210 mW
T: (65 ±2) °C
t: 1000 h
< 2%
4)
Solderability IEC
60068-2-58
JIS C 0054
Solderability:
(215 ±3) °C, (3 ±0.3) s
(245 ±5) °C, (3 ±0.3) s
Resistance to soldering heat:
(260 ±5) °C, (10 ±1) s
95% of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
< 1%
5)
1) Except B57620C5102+062 ∆R
25
/R
25
(typical): < 6%, B57620C5103+062 ∆R
25
/R
25
(typical): < 3%
2) Except B57620C5102+062 and B57620C5103+062 duration: 21 days, ∆R
25
/R
25
(typical): < 3%
3) Except B57620C5102+062 and B57620C5103+062 number of cycles: 10, ∆R
25
/R
25
(typical): < 3%
4) Except B57620C5102+062 and B57620C5103+062 ∆R
25
/R
25
(typical): < 5%
5) Except B57620C5102+062 and B57620C5103+062 ∆R
25
/R
25
(typical): < 5%
Temperature measurement and compensation B574**V2/ B57620C5
SMD NTC thermistors, case size 0805 (2012) Standard series
Page 4 of 21Please read Cautions and warnings and
Important notes at the end of this document.