NTC thermistors for temperature measurement Glass-encapsulated sensors, standard type Series/Type: B57560G, B57560G1 Date: February 2009in this data sheet are being withdrawn. The following products presented Ordering Code Substitute Product B57560G0145* B57560G1104* Date of Withdrawal 2012-03-23 Deadline Last Orders 2012-06-28 Last Shipments 2012-09-28 For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 Applications Temperature measurement Dimensional drawing Features Glass-encapsulated, heat-resistive and highly stable For temperature measurement up to 300 °C Leads: dumet wires (copper-clad FeNi) Options Leads: nickel-plated dumet wires Alternative dimensions available on request Delivery mode Bulk Dimensions in mm General technical data Climatic category Max.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 Electrical specification and ordering codes R25 Ω 2k 2k 5k 5k 10 k 10 k 10 k 10 k 20 k 20 k 30 k 30 k 50 k 50 k 100 k 100 k 1400 k 1400 k No.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 Reliability data Test Standard Storage in dry heat IEC 60068-2-2 Storage in damp heat, steady state Rapid temperature cycling Test conditions Storage at upper category temperature T: 300 °C t: 1000 h IEC Temperature of air: 85 °C 60068-2-67 Relative humidity of air: 85% Duration: 56 days IEC Lower test temperature: 55 °C 60068-2-14 Upper test temperature: 200 °C Number of cycles: 1000 Please read Cautions and warning
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 R/T characteristics R/T No. T (°C) 7002 7003 8304 B25/100 = 3988 K B25/100 = 3625 K B25/100 = 4092 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 96.33 66.866 47.037 33.508 24.156 7.4 7.2 6.9 6.7 6.4 63.225 45.46 33.07 24.324 18.081 6.7 6.5 6.3 6.0 5.8 30.0 25.0 20.0 15.0 10.0 17.613 12.98 9.6643 7.2656 5.5129 6.2 6.0 5.8 5.6 5.4 13.575 10.29 7.8716 6.0739 4.7258 5.6 5.4 5.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors R/T No. T (°C) 160.0 165.0 7002 G560/G1560 7003 8304 B25/100 = 3988 K B25/100 = 3625 K B25/100 = 4092 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 0.014679 2.2 0.021665 2.0 0.012967 2.3 0.013149 2.2 0.019613 2.0 0.011566 2.3 170.0 175.0 180.0 185.0 190.0 0.011806 0.010623 0.0095804 0.0086582 0.0078408 2.1 2.1 2.0 2.0 2.0 0.017793 0.016176 0.014735 0.013448 0.012297 1.9 1.9 1.8 1.8 1.8 0.010341 0.0092664 0.0083224 0.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 R/T characteristics R/T No. T (°C) 8307 8401 8402 B25/100 = 3492 K B0/100 = 3390 K B0/100 = 3450 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 52.624 38.452 28.401 21.194 15.972 6.4 6.2 6.0 5.8 5.6 48.237 35.488 26.39 19.825 15.037 6.2 6.0 5.8 5.6 5.4 51.991 37.989 28.07 20.96 15.809 6.4 6.2 5.9 5.7 5.5 30.0 25.0 20.0 15.0 10.0 12.149 9.3246 7.2181 5.6332 4.4308 5.4 5.2 5.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors R/T No. T (°C) 160.0 165.0 8307 G560/G1560 8401 8402 B25/100 = 3492 K B0/100 = 3390 K B0/100 = 3450 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 0.024694 2.0 0.026197 1.9 0.024442 2.0 0.022414 1.9 0.023822 1.9 0.022175 1.9 170.0 175.0 180.0 185.0 190.0 0.020385 0.018577 0.016961 0.015514 0.014216 1.9 1.8 1.8 1.8 1.7 0.021707 0.01982 0.018132 0.016619 0.01526 1.8 1.8 1.8 1.7 1.7 0.02016 0.018365 0.016762 0.015328 0.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 R/T characteristics R/T No. T (°C) 55.0 50.0 45.0 40.0 35.0 8403 8406 8415 B0/100 = 3970 K B200/300 = 5133 K B0/100 = 3970 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 103.29 71.079 49.619 35.108 25.158 7.6 7.3 7.1 6.8 6.5 183.3 120.69 80.721 54.792 37.713 8.5 8.2 7.9 7.6 7.3 103.29 71.079 49.619 35.108 25.158 7.6 7.3 7.1 6.8 6.5 30.0 25.0 20.0 15.0 10.0 18.245 13.383 9.9221 7.4316 5.6202 6.3 6.1 5.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors R/T No. T (°C) 160.0 165.0 8403 G560/G1560 8406 8415 B0/100 = 3970 K B200/300 = 5133 K B0/100 = 3970 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 0.014473 2.2 0.0076052 2.6 0.014473 2.2 0.012962 2.2 0.0066796 2.6 0.012962 2.2 170.0 175.0 180.0 185.0 190.0 0.011636 0.010469 0.0094395 0.0085294 0.0077229 2.1 2.1 2.0 2.0 2.0 0.0058817 0.005192 0.0045943 0.0040749 0.0036225 2.5 2.5 2.4 2.4 2.3 0.011636 0.010469 0.0094395 0.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 Mounting instructions 1 Soldering 1.1 Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Dip soldering Iron soldering Bath temperature max. 260 °C max.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 Bending strength: Test Ub: Two 90°-bends in opposite directions at a weight of 0.25 kg. Torsional strength: Test Uc: severity 2 The lead is bent by 90° at a distance of 6 to 6.5 mm from the thermistor body. The bending radius of the leads should be approx. 0.75 mm. Two torsions of 180° each (severity 2).
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 The components should be left in the original packing. Touching the metallization of unsoldered thermistors may change their soldering properties.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 Cautions and warnings General See "Important notes" at the end of this document. Storage Store thermistors only in original packaging. Do not open the package prior to storage. Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 Mounting Ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. The maximum temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral.
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 Symbols and terms Symbol English German A AWG Area American Wire Gauge Fläche Amerikanische Norm für Drahtquerschnitte B B25/100 B value B value determined by resistance measurement at 25 °C and 100 °C B-Wert B-Wert, ermittelt durch Widerstandsmessungen bei 25 °C und 100 °C Cth Heat capacitance Wärmekapazität I Current Strom N Number (integer) Anzahl (ganzzahliger Wert) P25 Pdiss Pel Pmax Maximum power at
Temperature measurement B57560G, B57560G1 Glass-encapsulated sensors G560/G1560 Symbol English German α Temperature coefficient Temperaturkoeffizient ∆ Tolerance, change Toleranz, Änderung δth Dissipation factor Wärmeleitwert τc τa Thermal cooling time constant Thermal time constant Thermische Abkühlzeitkonstante Thermische Zeitkonstante Abbreviations / Notes Symbol English German Surface-mounted devices Oberflächenmontierbares Bauelement * To be replaced by a number in ordering Pla
Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned.
