NTC thermistors for temperature measurement SMD NTC thermistors, case size 1206 (3216) Series/Type: B57621C5* Date: June 2011 © EPCOS AG 2011. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) Applications Temperature measurement and compensation Dimensional drawing Features SMD NTC with/ without inner electrodes Nickel barrier termination Excellent long-term aging stability in high-temperature environment Options Alternative resistance ratings, resistance tolerances and B value tolerances available on request. Delivery mode Blister tape, 180-mm reel (standard) Dimensions in mm Approx.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) Reliability data SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a standardized PCB in accordance with IEC 60539-1.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) R/T characteristics R/T No. T (°C) 1008 1010 1309 B25/100 = 3560 K B25/100 = 3530 K B25/100 = 3520 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 53.104 39.318 29.325 22.03 16.666 6.1 6.0 5.8 5.7 5.5 52.826 38.643 28.574 21.346 16.1 6.4 6.1 5.9 5.7 5.5 48.46 35.8 26.694 20.085 15.247 6.1 6.0 5.8 5.6 5.4 30.0 25.0 20.0 15.0 10.0 12.696 9.7251 7.5171 5.8353 4.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) R/T characteristics R/T No. 3206 T (°C) B25/100 = 3450 K T (°C) RT/R25 α (%/K) B25/100 = 3450 K T (°C) RT/R25 α (%/K) B25/100 = 3450 K RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 59.147 42.651 31.088 22.903 17.052 6.7 6.4 6.2 6.0 5.8 10.0 15.0 20.0 25.0 30.0 1.8287 1.4855 1.2149 1.0000 0.82816 4.2 4.1 4.0 3.8 3.7 75.0 80.0 85.0 90.0 95.0 0.19136 0.16618 0.14484 0.12668 0.11117 2.9 2.8 2.7 2.7 2.
Temperature measurement and compensation SMD NTC thermistors, case size 1206 (3216) Taping and packing 1 Taping of SMD NTC thermistors 1.1 Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3) Dimensions (mm) Case size 0402 (8-mm tape) Case size 0603 (8-mm tape) Tolerance A0 × B0 0.60 × 1.15 0.95 × 1.80 ±0.2 T2 0.70 1.10 T 0.60 0.90 max. D0 1.50 1.50 ±0.10 P0 4.00 4.00 ±0.101) P2 2.00 2.00 ±0.05 P1 2.00 4.00 ±0.10 W 8.00 8.00 ±0.30 E 1.75 1.75 ±0.
Temperature measurement and compensation SMD NTC thermistors, case size 1206 (3216) 1.2 Blister tape for case size 0805 and 1206 (taping to IEC 60286-3) Dimensions (mm) Case size 0805 (8-mm tape) Case size 1206 (8-mm tape) Tolerance A0 × B0 1.60 × 2.40 1.90 × 3.50 ±0.2 K0 1.40 1.40 max. T2 2.5 2.5 max. D0 1.50 1.50 +0.10/–0 D1 1.00 1.00 min. P0 4.00 4.00 ±0.102) P2 2.00 2.00 ±0.05 P1 4.00 4.00 ±0.10 W 8.00 8.00 ±0.30 E 1.75 1.75 ±0.10 F 3.50 3.50 ±0.05 G 0.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) 1.3 Reel packing Packing survey Case size Chip 8-mm tape thickness3) Reel dimensions Packing units mm mm pcs./reel Blister Card- A board Tol. W1 Tol. W2 180-mm 330-mm reel reel 0402 0.5 x 180 3/+0 8.4 +1.5/ 0 14.4 max. 10000 0603 0.8 x 180 3/+0 8.4 +1.5/ 0 14.4 max. 4000 330 ±2.0 12.4 +1.5/ 0 18.4 max. 16000 0805 0.8 x 8.4 12.4 +1.5/ 0 +1.5/ 0 14.4 max. 18.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) 2 Packing codes The last two digits of the complete ordering code state the packing mode: Last two digits 60 SMD Cardboard tape 180-mm reel packing 62 SMD Blister tape 180-mm reel packing 70 SMD Cardboard tape 330-mm reel packing 72 SMD Blister tape 330-mm reel packing Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) Mounting instructions 1 Soldering 1.1 SMD NTC thermistors SMD NTC thermistors can be provided with a nickel barrier termination or on special request with silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommended as well as a proper cleaning of the PCB.
Temperature measurement and compensation SMD NTC thermistors, case size 1206 (3216) Wave soldering Temperature characteristic at component terminal with dual wave soldering Solder joint profiles for silver/nickel/tin terminations Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) Reflow soldering Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D Profile feature Preheat and soak - Temperature min - Temperature max - Time Average ramp-up rate Liquidous temperature Time at liquidous Peak package body temperature Time (tP)3) within 5 °C of specified classification temperature (Tc) Average ramp-down rate Time 25 °C to peak temperature Tsmin Tsmax tsmin t
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) Solder joint profiles for silver/nickel/tin terminations 1.1.3 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 1.1.4 Notes Iron soldering should be avoided, hot air methods are recommended for repair purposes.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) 2 Conductive adhesion An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert. 3 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) 7 Placement and orientation of SMD NTC thermistors on PCB a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) Cautions and warnings General See "Important notes". Storage Store thermistors only in original packaging. Do not open the package prior to storage. Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. Do not store thermistors where they are exposed to heat or direct sunlight.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) Mounting Ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. The maximum temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral.
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) Symbols and terms Symbol English German A Area Fläche B B25/100 B value B value determined by resistance measurement at 25 °C and 100 °C B-Wert B-Wert, ermittelt durch Widerstandsmessungen bei 25 °C und 100 °C Cth Heat capacitance Wärmekapazität I Current Strom N Number (integer) Anzahl (ganzzahliger Wert) P25 Pdiss Pel Pmax Maximum power at 25 °C Power dissipation Electrical power Maximum pow
Temperature measurement and compensation B57621C5* SMD NTC thermistors, case size 1206 (3216) Symbol English German α Temperature coefficient Temperaturkoeffizient ∆ Tolerance, change Toleranz, Änderung δth Dissipation factor Wärmeleitwert τc τa Thermal cooling time constant Thermal time constant Thermische Abkühlzeitkonstante Thermische Zeitkonstante Abbreviations / Notes Symbol English German Surface-mounted devices Oberflächenmontierbares Bauelement * To be replaced by a number in
Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned.
