Datasheet

Reliability data
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test Standard Test conditions ∆R
25
/R
25
(typical)
Remarks
Storage in
dry heat
IEC
60068-2-2
JIS C 0021
Storage at upper
category temperature
T: (125 ±2) °C
t: 1000 h
< 3%
1)
Storage in damp
heat, steady state
IEC
60068-2-78
JIS C 0022
Temperature of air: (40 ±2) °C
Relative humidity of air:
(93 +2/3)%
Duration: 21 days
< 3% No visible
damage
Rapid temperature
cycling
IEC
60068-2-14
JIS C 0025
Lower test temperature: 55 °C
Upper test temperature: 125 °C
Number of cycles: 10
< 3%
Endurance P
max
: 300 mW
T: (65 ±2) °C
t: 1000 h
< 5%
Solderability IEC
60068-2-58
JIS C 0054
Solderability:
(215 ±3) °C, (3 ±0.3) s
(245 ±5) °C, (3 ±0.3) s
Resistance to soldering heat:
(260 ±5) °C, (10 ±1) s
95% of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
< 5%
1) Except type B57621C5102+062 and B57621C5472+062 ∆R
25
/R
25
: < 6%
Temperature measurement and compensation B57621C5*
SMD NTC thermistors, case size 1206 (3216)
Page 3 of 20Please read Cautions and warnings and
Important notes at the end of this document.