NTC thermistors for temperature measurement Leaded NTC thermistors, lead spacing 2.5 mm Series/Type: B57891S Date: March 2013 © EPCOS AG 2013. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Applications Temperature measurement and compensation Dimensional drawing Features Favorable price/ performance ratio Rugged design, epoxy resin encapsulation Leads: copper-clad Fe wire, tinned UL approval (E69802) Options Lead spacing 5 mm available on request Delivery mode Bulk (standard), cardboard tape, reeled or in Ammo pack on request Dimensions in mm Approx. weight 0.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 R/T characteristics R/T No. T (°C) 1008 2003 2904 B25/100 = 3560 K B25/100 = 3980 K B25/100 = 4300 K RT/R25 α (%/K) RT/R25 α (%/K) RT/R25 α (%/K) 55.0 50.0 45.0 40.0 35.0 53.104 39.318 29.325 22.03 16.666 6.1 6.0 5.8 5.7 5.5 97.578 67.65 47.538 33.831 24.359 7.5 7.2 7.0 6.7 6.5 30.0 25.0 20.0 15.0 10.0 12.696 9.7251 7.5171 5.8353 4.5686 5.4 5.2 5.1 4.9 4.8 17.753 13.067 9.7228 7.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 R/T No. T (°C) 160.0 165.0 1008 2003 2904 B25/100 = 3560 K RT/R25 α (%/K) 0.02279 2.0 0.020667 2.0 B25/100 = 3980 K RT/R25 α (%/K) B25/100 = 4300 K RT/R25 α (%/K) 170.0 175.0 180.0 185.0 190.0 0.01878 0.01709 0.015582 0.014227 0.013012 1.9 1.9 1.8 1.8 1.8 195.0 200.0 205.0 210.0 215.0 0.011934 0.010964 0.0101 0.0093191 0.0085949 1.7 1.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 R/T characteristics R/T No. T (°C) 55.0 50.0 45.0 40.0 35.0 4003 4901 B25/100 = 4450 K B25/100 = 3950 K RT/R25 α (%/K) RT/R25 α (%/K) 103.81 73.707 52.723 37.988 27.565 6.8 6.7 6.6 6.5 6.4 87.89 61.759 43.934 31.618 23.006 7.1 6.9 6.7 6.5 6.3 30.0 25.0 20.0 15.0 10.0 20.142 14.801 10.976 8.1744 6.1407 6.2 6.1 5.9 5.8 5.7 16.915 12.555 9.4143 7.1172 5.4308 6.1 5.9 5.7 5.5 5.4 5.0 0.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Taping and packing 1 Taping of SMD NTC thermistors 1.1 Cardboard tape for case size 0402 and 0603 (taping to IEC 60286-3) Dimensions (mm) Case size 0402 (8-mm tape) Case size 0603 (8-mm tape) Tolerance A0 × B0 0.60 × 1.15 0.95 × 1.80 ±0.2 T2 0.70 1.10 T 0.60 0.90 max. D0 1.50 1.50 ±0.10 P0 4.00 4.00 ±0.101) P2 2.00 2.00 ±0.05 P1 2.00 4.00 ±0.10 W 8.00 8.00 ±0.30 E 1.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 1.2 Blister tape for case size 0805 and 1206 (taping to IEC 60286-3) Dimensions (mm) Case size 0805 (8-mm tape) Case size 1206 (8-mm tape) Tolerance A0 × B0 1.60 × 2.40 1.90 × 3.50 ±0.2 K0 1.40 1.40 max. T2 2.5 2.5 max. D0 1.50 1.50 +0.10/–0 D1 1.00 1.00 min. P0 4.00 4.00 ±0.102) P2 2.00 2.00 ±0.05 P1 4.00 4.00 ±0.10 W 8.00 8.00 ±0.30 E 1.75 1.75 ±0.10 F 3.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 1.3 Reel packing Packing survey Case size Chip 8-mm tape thickness3) Reel dimensions mm mm Blister Card- A board Packing units pcs./reel Tol. W1 Tol. W2 180-mm 330-mm reel reel 0402 0.5 x 180 3/+0 8.4 +1.5/ 0 14.4 max. 10000 0603 0.8 x 180 3/+0 8.4 +1.5/ 0 14.4 max. 4000 330 ±2.0 12.4 +1.5/ 0 18.4 max. 16000 0805 1206 2 0.8 x 3/+0 ±2.0 8.4 12.4 +1.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 3 Taping of radial leaded NTC thermistors Dimensions and tolerances Lead spacing F = 2.5 mm and 5.0 mm (taping to IEC 60286-2) Dimensions (mm) w th d P0 P1 F ∆h ∆p W W0 W1 W2 H H0 H1 D0 t L L1 Lead spacing 2.5 mm 11.0 5.0 0.5/0.6 12.7 5.1 2.5 0 0 18.0 5.5 9.0 3.0 18.0 16.0 32.2 4.0 0.9 11.0 4.0 Lead spacing 5 mm 11.5 6.0 0.5/0.6 12.7 3.85 5.0 0 0 18.0 5.5 9.0 3.0 18.0 16.0 32.2 4.0 0.9 11.0 4.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Types of packing Ammo packing Ammo type x y z I 80 240 210 Packing unit: 1000 - 2000 pcs./reel Reel packing Packing unit: 1000 - 2000 pcs./reel Reel dimensions (in mm) Reel type d f n w I 360 max. 31 ±1 approx. 45 54 max. II 500 max. 23 ±1 approx. 59 72 max. Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Cassette packing Packing unit: 1000 - 2000 pcs./cassette Bulk packing The components are packed in cardboard boxes, the size of which depends on the order quantity. Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Mounting instructions 1 Soldering 1.1 Leaded NTC thermistors Leaded thermistors comply with the solderability requirements specified by CECC. When soldering, care must be taken that the NTC thermistors are not damaged by excessive heat. The following maximum temperatures, maximum time spans and minimum distances have to be observed: Dip soldering Iron soldering Bath temperature max. 260 °C max.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 1.3.1 Solderability (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32. Evaluation criterion: Wetting of soldering areas ≥95%. Solder Bath temperature (°C) Dwell time (s) SnPb 60/40 215 ±3 3 ±0.3 SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9) 245 ±3 3 ±0.3 1.3.2 Resistance to soldering heat (test to IEC 60068-2-58) Preconditioning: Immersion into flux F-SW 32.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Wave soldering Temperature characteristic at component terminal with dual wave soldering Solder joint profiles for silver/nickel/tin terminations Please read Cautions and warnings and Important notes at the end of this document.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Solder joint profiles for silver/nickel/tin terminations 1.3.3 Recommended geometry of solder pads Recommended maximum dimensions (mm) Case size inch/mm A B C 0402/1005 0.6 0.6 1.7 0603/1608 1.0 1.0 3.0 0805/2012 1.3 1.2 3.4 1206/3216 1.8 1.2 4.5 1.3.4 Notes Iron soldering should be avoided, hot air methods are recommended for repair purposes.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 2 Conductive adhesion An alternative to soldering is the gluing of thermistors with conductive adhesives. The benefit of this method is that it involves no thermal stress. The adhesives used must be chemically inert. 3 Clamp contacting Pressure contacting by means of clamps is particularly suitable for applications involving frequent switching and high turn-on powers.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 5 Sealing and potting When thermistors are sealed, potted or overmolded, there must be no mechanical stress caused by thermal expansion during the production process (curing / overmolding process) and during later operation. The upper category temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing / potting compound and plastic material) are chemically neutral.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 8 Placement and orientation of SMD NTC thermistors on PCB a) Component placement It is recommended that the PC board should be held by means of some adequate supporting pins such as shown left to prevent the SMDs from being damaged or cracked.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Cautions and warnings See "Important notes". Storage Store thermistors only in original packaging. Do not open the package prior to storage. Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative humidity ≤75% annual mean, <95% maximum 30 days per annum, dew precipitation is inadmissible. Do not store thermistors where they are exposed to heat or direct sunlight.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.5 mm S891 Mounting Ensure that no thermo-mechanical stress occurs due to production processes (curing or overmolding processes) when thermistors are sealed, potted or overmolded or during their subsequent operation. The maximum temperature of the thermistor must not be exceeded. Ensure that the materials used (sealing/potting compound and plastic material) are chemically neutral.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.
Temperature measurement and compensation B57891S Leaded NTC thermistors, lead spacing 2.
Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned.
