Datasheet

4 Solderability tests
Test Standard Test conditions /
Sn-Pb soldering
Test conditions /
Pb-free soldering
Criteria / test results
Wettability IEC
60068-2-58
Immersion in
60/40 SnPb solder
using non-activated
flux at 215 ±3 °C for
3 ±0.3 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ±5 °C
for 3 ±0.3 s
Covering of 95%
of end termination,
checked by visual
inspection
Leaching
resistance
IEC
60068-2-58
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 255 ±5 °C
for 10 ±1 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ±5 °C
for 10 ±1 s
No leaching of
contacts
Tests of
resistance to
soldering heat
for SMDs
IEC
60068-2-58
Immersion in
60/40 SnPb for 10 s
at 260 °C
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 °C
Capacitance change:
15% ≤∆C ≤15%
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on the substrate.
As single chip As mounted on substrate
CeraDiodes
Standard series
Page 15 of 19Please read Cautions and warnings and
Important notes at the end of this document.