Datasheet

4 Solderability tests
Test Standard Test conditions /
Sn-Pb soldering
Test conditions /
Pb-free soldering
Criteria / test results
Wettability IEC
60068-2-58
Immersion in
60/40 SnPb solder
using non-activated
flux at 215 ±3 °C for
3 ±0.3 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ±5 °C
for 3 ±0.3 s
Covering of 95%
of end termination,
checked by visual
inspection
Leaching
resistance
IEC
60068-2-58
Immersion in
60/40 SnPb
solder using
mildly activated flux
without preheating
at 255 ±5 °C
for 10 ±1 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ±5 °C
for 10 ±1 s
No leaching of
contacts
Tests of
resistance to
soldering heat
for SMDs
IEC
60068-2-58
Immersion in
60/40 SnPb for 10 s
at 260 °C
Immersion in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 °C
Capacitance change:
15% ≤∆C ≤15%
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on the substrate.
As single chip As mounted on substrate
CeraDiodes
High-speed series
Page 15 of 19Please read Cautions and warnings and
Important notes at the end of this document.