Specifications

SED1560 Series
7–56 EPSON
TCP DIMENSIONS (2 ways)
(Punching hole for good product)
(Mold, marking area)
(Mold, marking area)
SR batten
PI batten
Output terminal pattern shape
Specifications • Base: U-rexS, 75µm
• Copper foil: Electrolytic copper foil, 35µm
• Sn plating • Product pitch: 111P (52.25mm) • Solder resist positional tolerance: ±0.3