Installation Guide
Table Of Contents
- 1 Product Overview
- 2 Communication
- 3 Hardware Overview
- 4 Routing guidelines
- 5 Production Guideline
- 6 Packaging – Tape and Reel Information
- 7 SW integration
- 8 Operational and Regulatory information
- 9 Environmental Declaration
- 10 Terminology and Abbreviations
C5621 and C33 User Guide
1/1553-KRD 131 24 Uen Rev D 2011-11-22
Ericsson AB 2011
15 (37)
Ericsson Confidential
4.3 Power Routing
4.3.1 VBAT Routing
The VBAT pads should have a direct, low impedance connection to a
battery
The decoupling should be placed close to VBAT pads
VBAT net shall be designed such that the supply voltage to the module is
always within its operating range even at the maximum current
consumption (worst case being 2G transmit operation). Refer to chapter
4.3.3.1 for details
4.3.2 GND
On the layers where a power plane is implemented, a cut-out creating a local
GND plane should be implemented. The local plane should be connected to
the complete GND planes with as many vias as possible; this will increase the
thermal coupling.
4.4 RF Routing
RF signals must have a controlled impedance of 50 Ohm
The signals should be directly connected to respective antennas / antenna
connectors
It is important to isolate the RF-lines from any unwanted signal or noise.
RF stripline is a good choice for realization of RF-lines since it provides
good shielding from both radiated and conducted noise. Care must also be
taken to isolate main/diversity/GPS traces with regards to each other.
Via fence around the stripline, creating an embedded RF cage in the PCB,
will improve isolation. Care shall be taken while calculating trace
impedance since via fence placed very close to the RF striplines, may
lower the impedance somewhat.
Via stub should be eliminated or minimized