Installation Guide
Table Of Contents
- 1 Product Overview
- 2 Communication
- 3 Hardware Overview
- 4 Routing guidelines
- 5 Production Guideline
- 6 Packaging – Tape and Reel Information
- 7 SW integration
- 8 Operational and Regulatory information
- 9 Environmental Declaration
- 10 Terminology and Abbreviations
C5621 and C33 User Guide
1/1553-KRD 131 24 Uen Rev D 2011-11-22
Ericsson AB 2011
16 (37)
Ericsson Confidential
5 Production Guideline
5.1 Package type
C5621 / C33 module has ENIG bottom terminations with a LGA design; no
solder mask is present at the underside of the package.
Figure 4, Top view of C5621/C33
5.2 Floor life and dry storage
The CE module should be stored in a dry pack and handled according to
IPC/JEDEC J-STD-033B.1, MSL 3 with bake at:
• 125 °C, when supplied on JEDEC tray
• 40 °C ≤5% RH when supplied on 44 mm tape and reel
5.3 Screen stencil design
Material: Stainless steel
Thickness: 0.1 mm (~4 mil)
Aperture size: Ø 0.63 mm (277x)
All solder paste deposits should be centered on the PCB.
5.4 Assembly
Pick-up position should be centered on the package topside.
Nozzle Ø: 10-20 mm