Data Sheet

NOTE : Specification subject to change without notice.
2014/9/19
9. Pad Layouts
、
Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device
Profile Feature
Pb
-
Free Assembly
Average Ramp
-
Up Rate
(Tsmax to Tp)
3
℃
/second max.
Preheat
:
Temperature Min (Tsmin)
Temperature Max (Tsmax)
Time (tsmin to tsmax)
150
℃
200
℃
60-180 seconds
Time maintained above:
Temperature(T
L
)
Time (t
L
)
217
℃
60-150 seconds
Peak/Classification Temperature(Tp)
:
260
℃
Time within 5
℃
of actual Peak :
Temperature (tp)
20-40 seconds
Ramp
-
Down Rate
:
6
℃
/second max.
Time 25
℃
to Peak Temperature :
8 minutes max.
Note 1: All temperatures refer to of the package,
measured on the package body surface.
Reflow Profile
Pad dimensions (millimeters)
Device
A
Nominal
B
Nominal
C
Nominal
All 1812 Series
3.45
1.78
3.5
0
Solder reflow
※ Due to “Lead Free” nature, Temperature and
Dwelling time for the soldering zone is higher
than those for Regular. This may cause
damage to other components.
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard
methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Envorinment : < 30℃ / 60%RH
Caution:
1. If reflow temperatures exceed the
recommended profile, devices may not meet
the performance requirements.
2. Devices are not designed to be wave soldered
to the bottom side of the board.