Data Sheet

Beijing Eswin Technology Co.,Ltd
2.7 Low-Power Management ....................................................................................................... 6
3. Peripheral Interface ......................................................................................................................... 6
3.1 General Purpose Input / Output Interface (GPIO) .................................................................. 6
3.2 Analog-to-Digital Converter (ADC) ...................................................................................... 7
3.3 SD/SDIO/MMC Host Controller ........................................................................................... 7
3.4 Universal Asynchronous Receiver Transmitter (UART) ....................................................... 7
3.5 I2C Interface .......................................................................................................................... 7
3.6 I2S Interface ........................................................................................................................... 8
3.7 Pulse Width Modulation (PWM) ........................................................................................... 8
3.8 Serial Peripheral Interface (SPI) ............................................................................................ 8
4. Electrical Characteristics ................................................................................................................. 8
4.1 Absolute Maximum Ratings .................................................................................................. 9
4.2 Recommended Operating Conditions .................................................................................... 9
4.3 Power Consumption Specifications ....................................................................................... 9
4.4 RX Specifications .................................................................................................................. 9
4.5 TX Specifications ................................................................................................................. 11
4.6 LO Specifications ................................................................................................................. 11
5. Pin definition ................................................................................................................................. 12
6. Package Information ...................................................................................................................... 12