Specifications

Configurations
110124-30002, preliminary
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Configurations
The Helios platform’s flexible design enables several options supporting many possible
combinations to meet your system requirements. These options are factory-installed,
and the system is configured for operation at the factory with the specific combination of
options. This section describes the options available for the Helios platform.
Processor
The Helios platform bases its architecture on the high-performance, low-power Catalyst
Module. This module is available in various versions based on the following features:
• Processor speed
• On-module DRAM
• Operating temperature
The standard system includes a 1.1 GHz, 512 MB Catalyst Module XL for the industrial
temperature range. For the various performance variants, see Processor, page 21.
Memory
Five types of memory provide mass storage options for the Helios platform. In addition,
the system can boot from any of these memory options. For information about boot
options, see Boot Options, page 9. The following sections describe the memory options.
CompactFlash® Card or SD Card
As an option, the Helios platform can include a CompactFlash® card or Secure
Digital/MultiMedia (SD/MMC) card. Both media provide mass storage in a wide variety of
capacities. Each type of card is located internal to the enclosure and is not accessible
when the system is completely assembled.
Note: The CompactFlash card option is mutually exclusive with
the SD card option. Only one card can be installed.
On-Board Flash
On-board PATA flash is available as an option populated in increments of 1 GB.
SATA Drive
As an option, the Helios platform can include a single, 2.5-inch form factor SATA drive
internal to the enclosure. For SATA drive specifications, see SATA Drive, page 23.
USB Disk Drive
A USB disk drive can connect to any of the five USB host ports on the Helios platform.