Datasheet

ManualsBrandsEverlight Electronics ManualsIR LEDsIR-LED 850nm 5mm

LifecyclePhase:

Revision : 2

Expired Period: Forever

Release Date:2012-02-17 14:59:32.0

www.everlight.com

5mm Infrared LED

HIR7373B/L289

Features

․High reliability

․High radiant intensity

․Peak wavelength λp=850nm

․2.54mm Lead spacing

․Low forward voltage

․Pb Free

․This product itself will remain within RoHS compliant version.

Description

․EVERLIGHT’s Infrared Emitting Diode (HIR7373B/L289) is a

high intensity diode , molded in a black plastic package.

․The device is spectrally matched with phototransistor , photodiode

and infrared receiver module.

Applications

․Infrared applied system

Summary of content (9 pages)

PAGE 1
5mm Infrared LED HIR7373B/L289 Features ․High reliability ․High radiant intensity ․Peak wavelength λp=850nm ․2.54mm Lead spacing ․Low forward voltage ․Pb Free ․This product itself will remain within RoHS compliant version. Description ․EVERLIGHT’s Infrared Emitting Diode (HIR7373B/L289) is a high intensity diode , molded in a black plastic package. ․The device is spectrally matched with phototransistor , photodiode and infrared receiver module.
PAGE 2
DATASHEET 5.0mm Infrared LED HIR7373B/L289 Device Selection Guide Chip Lens Color Materials GaAlAs Black Absolute Maximum Ratings (Ta=25℃) Parameter Symbol Rating Unit Continuous Forward Current IF 100 mA IFP 1.
PAGE 3
DATASHEET 5.0mm Infrared LED HIR7373B/L289 Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Min. Typ. Max. Unit Condition 21 40 ----- mW/sr IF=20mA ----- 200 ----- Radiant Intensity Ie Peak Wavelength λp ----- 850 ----- nm IF=20mA Spectral Bandwidth Δλ ----- 45 ----- nm IF=20mA Forward Voltage VF ----- 1.45 1.6 ----- 1.80 2.
PAGE 4
DATASHEET 5.0mm Infrared LED HIR7373B/L289 Typical Electro-Optical Characteristics Curves Forward Current vs. Ambient Temperature Spectral Distribution 140 100 IF=20mA Ta=25° C 120 80 100 60 80 60 40 40 20 20 0 0 -40 -20 0 20 40 60 80 100 Peak Emission Wavelength vs. Ambient Temperature 790 810 830 850 870 890 910 930 950 Forward Current vs.
PAGE 5
DATASHEET 5.0mm Infrared LED HIR7373B/L289 Radiant Intensity vs. Forward Current Relative Radiant Intensity vs. Angular Displacement -20 Ie-Radiant Intensity(mW/sr) 1000 -10 0 10 20 30 100 10 0 10 0 10 1 2 10 10 3 10 4 1.0 40 0.9 50 0.8 0.7 60 70 80 0.6 0.4 0.2 0 0.2 0.4 0.6 IF-Forward Current (mA) 5 Copyright Revision :2 © LifecyclePhase: Release Date:2012-02-17 14:59:32.0 2010, Everlight All Rights Reserved. Release Date : Feb.11.2012. Issue No: DIR-0000475_Rev.2 www.
PAGE 6
DATASHEET 5.0mm Infrared LED HIR7373B/L289 Package Dimension Note: Tolerances unless dimensions ±0.25mm 6 Copyright Revision :2 © LifecyclePhase: Release Date:2012-02-17 14:59:32.0 2010, Everlight All Rights Reserved. Release Date : Feb.11.2012. Issue No: DIR-0000475_Rev.2 www.everlight.
PAGE 7
DATASHEET 5.0mm Infrared LED HIR7373B/L289 Label Form Specification Pb EVERLIGHT ‧CPN: Customer’s Product Number ‧P/N: Product Number ‧QTY: Packing Quantity ‧CAT: Luminous Intensity Rank ‧HUE: Dom. Wavelength Rank ‧REF: Forward Voltage Rank ‧LOT No: Lot Number ‧X: Month ‧Reference: Identify Label Number X RoHS HIR7373B/L289 Packing Specification ■ Anti-electrostatic bag ■ Inner Carton ■ Outside Carton ■ Packing Quantity 1. 500 PCS/1 Bag, 5 Bags/1 Inner Carton 2.
PAGE 8
DATASHEET 5.0mm Infrared LED HIR7373B/L289 Notes 1. Lead Forming  During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb.  Lead forming should be done before soldering.  Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs.  Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs.
PAGE 9
DATASHEET 5.0mm Infrared LED HIR7373B/L289 Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the LEDs.  Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning  When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use.