User's Manual

BL600-Sx
Single Mode BLE Module
6 HW INTEGRATION GUIDE
6.1 Circuit Components Required on Host PCB
The BL600-series module is easy to integrate requiring no external components on the customer’s
board.
Note: In BL600 modules shipped from production with base firmware, all SIO pins (with “default
function” of “DIO”) are inputs. Remember to change the direction SIO pin (using smart
BASIC) if that particular pin is wired to a device that expects to be driven by the BL600
SIO pin configured as an output.
6.2 BL600-Sx General PCB Layout on Host PCB
 Ensure silk screen under module location (refer to land pattern of BL600 development
board)
 Use solid GND plane on inner layer (for best EMC and RF performance).
 Place GND vias close to module GND pads as possible.
 Route traces to avoid noise being picked up on VCC supply and SIO (digital) and AIN
(analogue) traces.
 Unused PCB area on surface layer can flood with copper but place GND vias regularly to
connect copper flood to inner GND plane.
6.3 BL600-SA Layout on Host PCB
The BL600-SA has an integrated chip antenna. It is critical to find the best placement of the BL600-
SA on the host PCB to allow the antenna to radiate. The following are a few helpful
guidelines:
 Ensure there is no copper in the antenna keep-out area on any layers of the host PCB. Keep
all mounting hardware and metal clear of the area to allow proper antenna radiation.
 For best antenna performance, place the module on the edge of the host PCB, preferably
in the corner with the antenna facing the corner.
 The antenna keep-out area is defined by the BL600 development board which was used for
module development and antenna performance evaluation. Keep-out area is shown in
Figure 1.
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