User's Manual
Table Of Contents
- Part # BL600-SA, BL600-SC, BL600-ST
- 3.1 SW Block diagram
- 3.3 Electrical Specifications
- 4.2 Measured waveforms
- 4.3 Peripheral block current consumption
- 5.1 Power management (includes brown-out and power on reset)
- 5.2 Clocks
- 5.3 Memory for smartBASIC application code
- 5.4 RF
- 5.5 UART Interface
- 5.6 SPI Bus
- 5.7 I2C Interface
- 5.8 General Purpose I/O and ADC
- 6.1 Circuit Components Required on Host PCB
- 6.2 BL600-Sx General PCB Layout on Host PCB
- 6.3 BL600-SA Layout on Host PCB
- 6.4 BL600-ST Layout on Host PCB
- 8.1 Introduction
- 8.2 Shipping
- 8.3 Reflow Parameters
- 9.2 OEM Responsibilities
- 10 Japan (MIC) Regulatory
- 11 CE Regulatory
- 12 EU DECLARATIONS OF CONFORMITY
- 14 ORDERING INFORMATION
BL600-Sx
Single Mode BLE Module
8.3 Reflow Parameters
Laird Technologies surface mount modules are designed to be easily manufactured, including
reflow soldering to a PCB. Ultimately it is the responsibility of the customer to choose the
appropriate solder paste and to ensure oven temperatures during reflow meet the requirements
of the solder paste. Laird Technologies’ surface mount modules conform to J-STD-020D1
standards for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 8-2: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in Table 9.
Table 9: Recommended Maximum and minimum temperatures
Specification
Value
Unit
Temperature Inc./Dec. Rate (max) 1~3 °C / Sec
Temperature Decrease rate (goal) 2-4 °C / Sec
Soak Temp Increase rate (goal) .5 - 1 °C / Sec
Flux Soak Period (Min) 70 Sec
Flux Soak Period (Max) 120 Sec
Flux Soak Temp (Min) 150 °C
Flux Soak Temp (max) 190 °C
Time Above Liquidous (max) 70 Sec
Time Above Liquidous (min) 50 Sec
Time In Target Reflow Range (goal) 30 Sec
Time At Absolute Peak (max) 5 Sec
Liquidous Temperature (SAC305) 218 °C
Lower Target Reflow Temperature 240 °C
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