Datasheet
© 2005 Fairchild Semiconductor Corporation DS012002 www.fairchildsemi.com
February 1994
Revised May 2005
74LCX16373 Low Voltage 16-Bit Transparent Latch with 5V Tolerant Inputs and Outputs
74LCX16373
Low Voltage 16-Bit Transparent Latch
with 5V Tolerant Inputs and Outputs
General Description
The LCX16373 contains sixteen non-inverting latches with
3-STATE outputs and is intended for bus oriented applica-
tions. The device is byte controlled. The flip-flops appear
transparent to the data when the Latch Enable (LE) is
HIGH. When LE is LOW, the data that meets the setup time
is latched. Data appears on the bus when the Output
Enable (OE
) is LOW. When OE is HIGH, the outputs are in
a high impedance state.
The LCX16373 is designed for low voltage (2.5V or 3.3V)
V
CC
applications with capability of interfacing to a 5V signal
environment.
The LCX16373 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Features
■ 5V tolerant inputs and outputs
■ 2.3V–3.6V V
CC
specifications provided
■ 5.4 ns t
PD
max (V
CC
3.3V), 20 A I
CC
max
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal (Note 1)
■ 24 mA output drive (V
CC
3.0V)
■ Latch-up performance exceeds 500 mA
■ ESD performance:
Human body model 2000V
Machine model
200V
■ Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
CC
through a pull-up resistor: the minimum value or the
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Note 2: Ordering code “G” indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Logic Symbol
Order Number Package Number Package Description
74LCX16373G
(Note 2)(Note 3)
BGA54A 54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LCX16373MEA
(Note 3)
MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LCX16373MTD
(Note 3)
MTD48 48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
■ Uses proprietary noise/EMI reduction circuitry