Datasheet

February 2013
© 2002 Fairchild Semiconductor Corporation www.fairchildsemi.com
BSS84 • Rev. 1.1.0
BSS84 — P-Channel Enhancement Mode Field-Effect Transistor
BSS84
P-Channel Enhancement Mode Field-Effect Transistor
Features
-0.13 A, -50 V, R
DS(ON)
= 10 Ω at V
GS
= -5 V
Voltage-Controlled P-Channel Small-Signal
Switch
High-Density Cell Design for Low R
DS(ON)
High Saturation Current
Description
This P-channel enhancement-mode field-effect
transistor is produced using Fairchild’s proprietary,
high cell density, DMOS technology. This very high
density process minimizes on-state resistance and to
provide rugged and reliable performance and fast
switching. The BSS84 can be used, with a minimum
of effort, in most applications requiring up to 0.13 A
DC and can deliver current up to 0.52 A. This product
is particularly suited to low-voltage applications
requiring a low-current high-side switch.
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. Values are at T
A
= 25°C unless otherwise noted.
Symbol
Parameter Ratings Unit
V
DSS
Drain-Source Voltage
50
V
V
GSS
Gate-Source Voltage
±20
V
I
D
Drain Current
(1)
Continuous
0.13
A
Pulsed
0.52
A
P
D
Maximum Power Dissipation
(1)
0.36
W
Derate Above 25°C
2.9
mW / °C
T
J
, T
STG
Operating and Storage Junction Temperature Range
55 to +150 °C
T
L
Maximum Lead Temperature for Soldering
Purposes, 1/16” from Case for 10 Seconds
300
°C
Thermal Characteristics
R
θJA
Thermal Resistance, Junction-to-Ambient
(1)
350
°C/W
Note:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference
is defined as the solder mounting surface of the drain pins. R
θJA
is guaranteed by design, while R
θJA
is
determined by the user's board design.
Scale 1: 1 on letter-size paper.
Package Marking and Ordering Information
Device Marking Device Reel Size Tape width Quantity
SP BSS84 7’’ 8mm 3000
a) 350°C/W when mounted on a minimum pad
G
D
S
SOT-23
D
SG

Summary of content (6 pages)