Datasheet

© 2011 Fairchild Semiconductor www.fairchildsemi.com
FAB3103 • Rev. 1.0.2
FAB3103 — 2.3 Watt Class-D Audio Amplifier with Integrated Boost Regulator and Automatic Gain Control
July 2012
FAB3103
2.3 Watt Class-D Audio Amplifier with Integrated
Boost Regulator and Automatic Gain Control
Features
High Output, Low Distortion Class-D Mono
Speaker Amplifier
o 2.3W into 8 from 3.6V Supply (10% THD+N)
o 1.85W into 8 from 3.6V Supply (1% THD+N)
o 0.01% THD+N into 8 (100mW)
High-Efficiency Boost Regulator Provides Higher
Output Power Over Li-Ion Battery Voltages
o 85% Total Efficiency (3.6V, 8, P
O
= 1.0W)
Adaptive Boost Shutdown at Lower Output Power
Increases Efficiency and Reduces Quiescent
Current Consumption:
o I
DD
= 2.7mA from 3.6V Supply
Automatic Gain Control (AGC) Monitors Battery
Voltage and Dynamically Adjusts Gain, Extending
Battery Runtime
Reduced Noise Floor Enhances Audio Playback
o 38µV Output Noise (A-Weighted)
o 100dB SNR (A-Weighted)
Low-EMI Design Allows Filterless Operation
High-Power Supply Ripple Rejection:
o 88dB PSRR (f
RIPPLE
= 217Hz, Boost Enabled)
o 70dB PSRR (f
RIPPLE
= 217Hz, Boost Bypassed)
High Noise Rejection Using Differential
Audio Inputs:
o 75dB CMRR (f
IN
= 1kHz)
o 71dB CMRR (f
IN
= 217Hz)
Short-Circuit Protection
Under-Voltage Protection
“Click and Pop” Suppression
Available in 12-Bump, 0.5mm Pitch, WLCSP
o Space-Saving 1.86mm x 1.44mm Package
Description
The FAB3103 is a mono Class-D audio amplifier with
an integrated boost regulator that achieves high output
audio over a power supply range of 2.5V to 5.2V.
Automatic Boost Shutdown dynamically shuts down
the boost regulator at low output power for greater
efficiency and lower quiescent current consumption.
Automatic Gain Control (AGC) monitors the battery
and reduces gain as the battery voltage drops to limit
maximum current consumption, extending battery
runtime and preventing mobile device shutdown.
Applications
Smart Phones, Feature Phones
Tablets, Portable Gaming Devices
GPS, Active Speakers
Figure 1. Typical Application Circuit
Ordering Information
Part Number Operating Temperature Range Package Packing Method
FAB3103UCX -40°C to +85°C
12-Bump, 0.5mm Pitch, Wafer-Level
Chip-Scale Package (WLCSP)
3000 Units
on Tape & Reel

Summary of content (13 pages)