Datasheet

© 2011 Fairchild Semiconductor www.fairchildsemi.com
FAB3103 • Rev. 1.0.2 12
FAB3103 — 2.3 Watt Class-D Audio Amplifier with Integrated Boost Regulator and Automatic Gain Control
Physical Dimensions
Figure 17. 12-Ball WLCSP, 3x4 Array, 0.5mm Pitch, 250µm Ball
Product Dimensions
Product D E X Y
FAB3103UCX 1.86mm 1.44mm 0.22mm 0.18mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent version. Package specifications do not expand Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent packaging drawings and tape and reel
specifications. http://www.fairchildsemi.com/packaging/
.
TOP VIEW
BOTTOM VIEW
RECOMMENDED LAND PATTERN (NSMD)
0.03
C
2X
(X)+/-.018
B
A
1
2
A
B
C
0.03
C
2X
0.005
CAB
0.50
0.50
3
D
SIDE VIEWS
12x Ø0.260
±0.02
SEATING PLANE
0.625
0.547
0.208±0.021
0.378±0.018
D
C
0.06
C
0.05
C
PIN 1 AREA
D
E
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASME Y14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC012AErev1
F
F
(Ø0.300)
SOLDER MASK
OPENING
(Ø0.200)
CU PAD
0.50
0.50
1.50
A1
E
(Y)+/-.018
F
F