Datasheet

November 2012
© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FAN21SV04 • Rev. 1.0.3
FAN21SV04 — TinyBuck™ 4 A, 24 V Single-Input Integrated Synchronous Buck Regulator
FAN21SV04 — TinyBuck™ 4 A, 24 V Single-Input
Integrated Synchronous Buck Regulator
Features
Single-Supply Operation with 4 A Output Current
Wide Input Range with Dual Supply: 3.0 V to 24 V
Wide Output Voltage Range: 0.8 V to 80% V
IN
Over 94% Peak Efficiency
1% Reference Accuracy Over Temperature
Fully Synchronous Operation with Integrated
Schottky Diode on Low-Side MOSFET Boosts
Efficiency
Single Supply Device for V
IN
> 6.5 V – 24 V
Programmable Frequency Operation (200-
600 KHz)
Synchronizable to External Clock with
Master/Slave Provisions
Power-Good Signal
Accepts Ceramic Capacitors on Output
External Compensation for Flexible Design
Starts on Pre-Bias Outputs
Integrated Bootstrap Diode
Programmable Over-Current Protection
Under-Voltage, Over-Voltage, and Thermal-
Shutdown Protections
5x6mm, 25-Pin, 3-Pad MLP Package
Applications
Servers & Telecom
Graphics Cards & Displays
Computing Systems
Set-Top Boxes & Game Consoles
Point-of-Load Regulation
Description
The FAN21SV04 TinyBuck™ is a highly efficient,
small-footprint, programmable-frequency, 4 A,
integrated synchronous buck regulator.
FAN21SV04 contains both synchronous MOSFETs
and a controller/driver with optimized interconnects in
one package, which enables designers to solve high-
current requirements in a small area with minimal
external components, thereby reducing cost. On-
board internal 5 V regulator enables single-supply
operation for input voltages >6.5 V.
The FAN21SV04 can be configured to drive multiple
slave devices OR synchronize to an external system
clock. In slave mode, FAN21SV04 may be set up to be
free-running in the absence of a master clock signal.
External compensation, programmable switching
frequency, and current-limit features allow for design
optimization and flexibility. High-frequency operation
allows for all-ceramic solutions.
Fairchild’s advanced BiCMOS power process,
combined with low-R
DS(ON)
internal MOSFETs and a
thermally efficient MLP package, provide the ability
to dissipate high power in a small package.
Integration helps minimize critical inductances,
making layout simpler and more efficient compared
to discrete solutions.
Output over-voltage, under-voltage, over-current, and
thermal-shutdown protections help protect the device
from damage during fault conditions. FAN21SV04
prevents pre-biased output discharge during startup in
point-of-load applications.
Related Resources
TinyCalc™ Calculator Design Tool
AN-8022 — TinyCalc™ Calculator User Guide
Ordering Information
Part Number
Operating
Temperature Range Package
Packing
Method
FAN21SV04MPX -10°C to 85°C Molded Leadless Package (MLP) 5x6 mm Tape and Reel
FAN21SV04EMPX -40°C to 85°C Molded Leadless Package (MLP) 5x6 mm Tape and Reel

Summary of content (18 pages)