Datasheet

© 2009 Fairchild Semiconductor Corporation www.fairchildsemi.com
FAN21SV04 • Rev. 1.0.3 4
FAN21SV04 — TinyBuck™ 4 A, 24 V Single-Input Integrated Synchronous Buck Regulator
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Parameter Conditions Min. Max. Units
VIN, VIN_Reg to AGND AGND=PGND 28 V
5V_Reg to AGND AGND=PGND 6 V
BOOT to PGND 35 V
BOOT to SW -0.5 6.0 V
SW to PGND
Continuous -0.5 24.0
V
Transient (t < 20 ns, f < 600 KHz) -5 30
All other pins -0.3 6.0 V
ESD
Electrostatic Discharge
Protection Level
Human Body Model,
JESD22-A114
1.5
kV
Charged Device Model,
JESD22-C101
2.5
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol Parameter Conditions Min. Typ. Max Units
f
SW
Switching Frequency 200 500 600 KHz
V
IN,
VIN_Reg
Supply Voltage for Power and Bias
VIN to PGND 3.0 24.0
V
VIN_Reg to AGND 6.5 24.0
T
A
Ambient Temperature
FAN21SV04MPX -10 +85
°C
FAN21SV04EMPX -40 +85
T
J
Junction Temperature +125 °C
Thermal Information
Symbol Parameter Min. Typ. Max. Units
T
STG
Storage Temperature -65 +150 °C
T
L
Lead Soldering Temperature, 30 Seconds +300 °C
θ
JC
Thermal Resistance: Junction-to-Case
P1 (Q2) 4
°C/W
P2 (Q1) 7
P3 4
θ
J-PCB
Thermal Resistance: Junction-to-Mounting Surface
(1)
35 °C/W
P
D
Total Power Dissipation in the package, T
A
=25°C
(1)
2.8 W
Note:
1. Typical thermal resistance when mounted on a four-layer, two-ounce PCB, as shown in Figure 38. Actual results
are dependent upon mounting method and surface related to the design.