Datasheet

December 2013
FCA47N60 / FCA47N60_F109 — N-Channel SuperFET
®
MOSFET
©2010 Fairchild Semiconductor Corporation
FCA47N60 / FCA47N60_F109 Rev. C2
www.fairchildsemi.com
1
FCA47N60 / FCA47N60_F109
N-Channel SuperFET
®
MOSFET
600 V, 47 A, 70 mΩ
Features
•650 V @ T
J
= 150°C
•Typ. R
DS(on)
= 58 mΩ
Ultra Low Gate Charge (Typ. Q
g
= 210 nC)
Low Effective Output Capacitance (Typ. C
oss(eff.)
= 420 pF)
100% Avalanche Tested
Application
Solar Invertor
AC-DC Power Supply
Description
SuperFET
®
MOSFET is Fairchild Semiconductor’s first genera-
tion of high voltage super-junction (SJ) MOSFET family that is
utilizing charge balance technology for outstanding low on-
resistance and lower gate charge performance. This technology
is tailored to minimize conduction loss, provide superior switch-
ing performance, dv/dt rate and higher avalanche energy. Con-
sequently, SuperFET MOSFET is very suitable for the switching
power applications such as PFC, server/telecom power, FPD
TV power, ATX power and industrial power applications.
D
G
S
G
S
D
TO-3PN
Absolute Maximum Ratings
Thermal Characteristics
Symbol Parameter FCA47N60 FCA47N60_F109 Unit
V
DSS
Drain-Source Voltage 600 V
I
D
Drain Current - Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C)
47
29.7
A
A
I
DM
Drain Current - Pulsed (Note 1)
141
A
V
GSS
Gate-Source voltage ± 30 V
E
AS
Single Pulsed Avalanche Energy (Note 2) 1800 mJ
I
AR
Avalanche Current (Note 1) 47 A
E
AR
Repetitive Avalanche Energy (Note 1) 41.7 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3) 4.5 V/ns
P
D
Power Dissipation (T
C
= 25°C)
- Derate above 25°C
417
3.33
W
W/°C
T
J,
T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300 °C
Symbol Parameter Typ. Max. Unit
R
θJC
Thermal Resistance, Junction-to-Case, Max. -- 0.3 °C/W
R
θJA
Thermal Resistance, Junction-to-Ambient, Max. -- 41.7 °C/W

Summary of content (8 pages)