Datasheet
©2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com
FCH47N60 / FCA47N60 Rev.B
FCH47N60 / FCA47N60
SuperFET
TM
December 2006
FCH47N60 / FCA47N60
Features
•650V @T
J
= 150°C
• Typ. Rds(on)=0.058Ω
• Ultra low gate charge (typ. Qg=210nC)
• Low effective output capacitance (typ. Coss.eff=420pF)
• 100% avalanche tested
Description
SuperFET
TM
is, Farichild’s proprietary, new generation of high
voltage MOSFET family that is utilizing an advanced charge
balance mechanism for outstanding low on-resistance and
lower gate charge performance.
This advanced technology has been tailored to minimize
conduction loss, provide superior switching performance, and
withstand extreme dv/dt rate and higher avalanche energy.
Consequently, SuperFET is very suitable for various AC/DC
power conversion in switching mode operation for system
miniaturization and higher efficiency.
Absolute Maximum Ratings
Thermal Characteristics
G
S
D
TO-247
FDH Series
GSD
TO-3P
FDA Series
D
G
S
Symbol Parameter FCH47N60 FCA47N60 Unit
V
DSS
Drain-Source Voltage 600 V
I
D
Drain Current - Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C)
47
29.7
A
A
I
DM
Drain Current - Pulsed
(Note 1)
141
A
V
GSS
Gate-Source voltage ± 30 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
1800 mJ
I
AR
Avalanche Current (Note 1) 47 A
E
AR
Repetitive Avalanche Energy (Note 1) 41.7 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns
P
D
Power Dissipation (T
C
= 25°C)
- Derate above 25°C
417
3.33
W
W/°C
T
J,
T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300 °C
Symbol Parameter Typ. Max. Unit
R
θJC
Thermal Resistance, Junction-to-Case -- 0.3 °C/W
R
θCS
Thermal Resistance, Case-to-Sink 0.24 -- °C/W
R
θJA
Thermal Resistance, Junction-to-Ambient -- 41.7 °C/W