Datasheet

October 2013
FCB20N60F — N-Channel SuperFET
®
FRFET
®
MOSFET
©2010 Fairchild Semiconductor Corporation
FCB20N60F Rev. C1
www.fairchildsemi.com
1
FCB20N60F
N-Channel SuperFET
®
FRFET
®
MOSFET
600 V, 20 A, 190 m
Features
650 V @T
J
= 150 °C
•Typ. R
DS(on)
= 150 m
Ultra Low Gate Charge (Typ. Q
g
= 75 nC)
Low Effective Output Capacitance (Typ. C
oss
.eff = 165 pF)
100% Avalanche Tested
RoHS Compliant
Applications
Description
SuperFET
®
MOSFET is Fairchild Semiconductor’s first genera-
tion of high voltage super-junction (SJ) MOSFET family that is
utilizing charge balance technology for outstanding low on-
resistance and lower gate charge performance. This technology
is tailored to minimize conduction loss, provide superior switch-
ing performance, dv/dt rate and higher avalanche energy. Con-
sequently, SuperFET MOSFET is very suitable for the switching
power applications such as PFC, server/telecom power, FPD
TV power, ATX power and industrial power applications. Super-
FET FRFET
®
MOSFET’s optimized body diode reverse recov-
ery performance can remove additional component and
improve system reliability.
Lighting AC-DC Power Supply
Solar Inverter
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwis noted
Thermal Characteristics
Symbol Parameter FCB20N60FTM Unit
V
DSS
Drain to Source Voltage 600 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 20
A
- Continuous (T
C
= 100
o
C) 12.5
I
DM
Drain Current - Pulsed (Note 1) 60 A
V
GSS
Gate to Source Voltage ±30 V
E
AS
Single Pulsed Avalanche Energy (Note 2) 690 mJ
I
AR
Avalanche Current (Note 1) 20 A
E
AR
Repetitive Avalanche Energy (Note 1) 20.8 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3) 50 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 208 W
- Derate above 25
o
C1.67W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FCB20N60FTM Unit
R
JC
Thermal Resistance, Junction to Case, Max. 0.6
o
C/W
R
JA
Thermal Resistance, Junction to Ambient (minimum pad of 2 oz copper), Max. 62.5
Thermal Resistance, Junction to Ambient (1 in
2
pad of 2 oz copper), Max. 40
G
S
D
D
2
-PAK
G
S
D

Summary of content (8 pages)