Datasheet
December 2013
FCD7N60 — N-Channel SuperFET
®
MOSFET
©2008 Fairchild Semiconductor Corporation
FCD7N60 Rev. C1
www.fairchildsemi.com
1
FCD7N60
N-Channel SuperFET
®
MOSFET
600 V, 7 A, 600 mΩ
Features
•650 V @ T
J
= 150°C
•Typ. R
DS(on)
= 530 mΩ
• Ultra Low Gate Charge (Typ. Q
g
= 23 nC)
• Low Effective Output Capacitance (Typ. C
oss(eff.)
= 60 pF)
• 100% Avalanche Tested
•RoHS Compliant
Application
• LCD / LED TV and Monitor
• Lighting
• Solar Inverter
• AC-DC Power Supply
Description
SuperFET
®
MOSFET is Fairchild Semiconductor’s first genera-
tion of high voltage super-junction (SJ) MOSFET family that is
utilizing charge balance technology for outstanding low on-
resistance and lower gate charge performance. This technology
is tailored to minimize conduction loss, provide superior switch-
ing performance, dv/dt rate and higher avalanche energy. Con-
sequently, SuperFET MOSFET is very suitable for the switching
power applications such as PFC, server/telecom power, FPD
TV power, ATX power and industrial power applications.
D-PAK
G
S
D
G
S
D
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter
FCD7N60TM /
FCD7N60TM_WS
Unit
V
DSS
Drain to Source Voltage 600 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 7
A
- Continuous (T
C
= 100
o
C) 4.4
I
DM
Drain Current - Pulsed (Note 1) 21 A
V
GSS
Gate to Source Voltage ±30 V
E
AS
Single Pulsed Avalanche Energy (Note 2) 230 mJ
I
AR
Avalanche Current (Note 1) 7A
E
AR
Repetitive Avalanche Energy (Note 1) 8.3 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3) 20 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 83 W
- Derate Above 25
o
C0.67W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter
FCD7N60TM /
FCD7N60TM_WS
Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 1.5
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 83