Datasheet
December 2013
©2009 Fairchild Semiconductor Corporation
FCH47N60 Rev. C2
www.fairchildsemi.com
1
FCH47N60 — N-Channel SuperFET
®
MOSFET
FCH47N60
N-Channel SuperFET
®
MOSFET
600 V, 47 A, 70 mΩ
Features
•650 V @ T
J
= 150°C
•Typ. R
DS(on)
= 58 mΩ
• Ultra Low Gate Charge (Typ. Q
g
= 210 nC)
• Low Effective Output Capacitance (Typ. C
oss(eff.)
= 420 pF)
• 100% Avalanche Tested
•RoHS Compliant
Applications
• Solar Inverter
• AC-DC Power Supply
Description
SuperFET
®
MOSFET is Fairchild Semiconductor’s first genera-
tion of high voltage super-junction (SJ) MOSFET family that is
utilizing charge balance technology for outstanding low on-
resistance and lower gate charge performance. This technology
is tailored to minimize conduction loss, provide superior switch-
ing performance, dv/dt rate and higher avalanche energy. Con-
sequently, SuperFET MOSFET is very suitable for the switching
power applications such as PFC, server/telecom power, FPD
TV power, ATX power and industrial power applications.
G
D
S
TO-247
G
S
D
MOSFET Maximum Ratings T
C
= 25°C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FCH47N60_F133 Unit
V
DSS
Drain to Source Voltage 600 V
I
D
Drain Current
Continuous (T
C
= 25°C) 47
A
Continuous (T
C
= 100°C) 29.7
I
DM
Drain Current Pulsed (Note 1) 141 A
V
GSS
Gate to Source Voltage ±30 V
E
AS
Single Pulsed Avalanche Energy (Note 2) 1800 mJ
I
AR
Avalanche Current (Note 1) 47 A
E
AR
Repetitive Avalanche Energy (Note 1) 41.7 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3) 4.5 V/ns
P
D
Power Dissipation
(T
C
= 25°C) 417 W
Derate Above 25°C 3.33 W/°C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering,
1/8” from Case for 5 Seconds
300 °C
Symbol Parameter FCH47N60_F133 Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 0.3 °C/W
R
θJA
Thermal Resistance, Case-to-Sink, Typ. 0.24 °C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 41.7 °C/W