Datasheet
November 2013
FCH47N60NF — N-Channel SupreMOS
®
FRFET
®
MOSFET
©2011 Fairchild Semiconductor Corporation
FCH47N60NF Rev. C2
www.fairchildsemi.com
1
G
D
S
TO-247
G
S
D
FCH47N60NF
N-Channel SupreMOS
®
FRFET
®
MOSFET
600 V, 45.8 A, 65 mΩ
Features
• 650 V @ T
J
= 150
o
C
•Typ. R
DS(on)
= 57.5 mΩ
• Ultra Low Gate Charge (Typ. Q
g
= 240 nC)
• Low Effective Output Capacitance (Typ. C
oss(eff.)
= 420 pF)
• 100% Avalanche Tested
• RoHS Compliant
Application
• Solar Inverter
• AC-DC Power Supply
Description
The SupreMOS
®
MOSFET is Fairchild Semiconductor’s next
generation of high voltage super-junction (SJ) technology
employing a deep trench filling process that differentiates it from
the conventional SJ MOSFETs. This advanced technology and
precise process control provides lowest Rsp on-resistance,
superior switching performance and ruggedness. SupreMOS
MOSFET is suitable for high frequency switching power con-
verter applications such as PFC, server/telecom power, FPD TV
power, ATX power and industrial power applications. Supre-
MOS FRFET
®
MOSFET’s optimized body diode reverse recov-
ery performance can remove additional component and
improve system reliability.
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
*Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol Parameter FCH47N60NF Unit
V
DSS
Drain to Source Voltage 600 V
V
GSS
Gate to Source Voltage ±30 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 45.8
A
- Continuous (T
C
= 100
o
C) 28.9
I
DM
Drain Current - Pulsed (Note 1) 137.4 A
E
AS
Single Pulsed Avalanche Energy (Note 2) 2926 mJ
I
AR
Avalanche Current (Note 1) 15.3 A
E
AR
Repetitive Avalanche Energy (Note 1) 3.7 mJ
dv/dt
MOSFET dv/dt 100 V/ns
Peak Diode Recovery dv/dt (Note 3) 50 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 368 W
- Derate Above 25
o
C2.94W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FCH47N60NF Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 0.34
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 40