Datasheet

©2009 Fairchild Semiconductor Corporation Rev.B2, October 2003
FCP11N60 / FCPF11N60 / FCPF11N60T
November 2009
SuperFET
TM
FCP11N60 / FCPF11N60 / FCPF11N60T
General Description
SuperFET
TM
is, Fairchild’s proprietary, new generation of
high voltage MOSFET family that is utilizing an advanced
charge balance mechanism for outstanding low on-
resistance and lower gate charge performance.
This advanced technology has been tailo
red to minimize
conduction loss, provide superior switching performance,
and withstand extreme dv/dt rate and higher avalanche
energy. Consequently, SuperFET is very suitable for
various AC/DC power conversion in switching mode
operation for system miniaturization and higher efficiency.
Features
650V @ Tj = 150°C
Typ. Rds(on) = 0.32Ω
Ultra low gate charge (typ. Qg=40nC)
Low effective output capacitance (typ. Coss.eff = 95pF)
100% avalanche tested
RoHS Compliant
Absolute Maximum Ratings T
C
= 25°C unless otherwise noted
Symbol Parameter FCP11N60 FCPF11N60(T) Units
I
D
Drain Current
- Continuous (T
C
= 25°C)
11 11* A
- Continuous (T
C
= 100°C)
7 7* A
I
DM
Drain Current - Pulsed
(Note 1)
33 33* A
V
GSS
Gate-Source Voltage ± 30 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
340 mJ
I
AR
Avalanche Current
(Note 1)
11 A
E
AR
Repetitive Avalanche Energy
(Note 1)
12.5 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
4.5 V/ns
P
D
Power Dissipation (T
C
= 25°C)
125 36 W
- Derate above 25°C 1.0 0.29 W/°C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300 °C
Thermal Characteristics
Symbol Parameter FCP11N60 FCPF11N60(T) Units
R
θJC
Thermal Resistance, Junction-to-Case 1.0 3.5 °C/W
R
θCS
Thermal Resistance, Case-to-Sink 0.5 -- °C/W
R
θJA
Thermal Resistance, Junction-to-Ambient 62.5 62.5 °C/W
{
{
{
{
{
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S
D
G
* Drain current limited by maximum junction termperature.
G D S
TO-220AB
FCP Series
TO-220F
FCPF Series
G
S
D

Summary of content (11 pages)