Datasheet

November 2013
FCP25N60N — N-Channel SupreMOS
®
MOSFET
©2010 Fairchild Semiconductor Corporation
FCP25N60N Rev. C1
www.fairchildsemi.com
1
FCP25N60N
N-Channel SupreMOS
®
MOSFET
600 V, 25 A, 125 mΩ
Features
•R
DS(on)
= 107 mΩ (Typ.) @ V
GS
= 10 V, I
D
= 12.5 A
Ultra Low Gate Charge (Typ. Q
g
= 57 nC)
Low Effective Output Capacitance (Typ. C
oss(eff.)
= 262 pF)
100% Avalanche Tested
RoHS Compliant
Application
Solar Inverter
AC-DC Power Supply
Description
The SupreMOS
®
MOSFET is Fairchild Semiconductor’s next
generation of high voltage super-junction (SJ) technology
employing a deep trench filling process that differentiates it from
the conventional SJ MOSFETs. This advanced technology and
precise process control provides lowest Rsp on-resistance,
superior switching performance and ruggedness. SupreMOS
MOSFET is suitable for high frequency switching power con-
verter applications such as PFC, server/telecom power, FPD TV
power, ATX power, and industrial power applications.
Absolute Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FCP25N60N_F102 Unit
V
DSS
Drain to Source Voltage 600 V
V
GSS
Gate to Source Voltage ±30 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 25
A
- Continuous (T
C
= 100
o
C) 16
I
DM
Drain Current - Pulsed (Note 1) 75 A
E
AS
Single Pulsed Avalanche Energy (Note 2) 861 mJ
I
AR
Avalanche Current (Note 1) 8.3 A
E
AR
Repetitive Avalanche Energy (Note 1) 2.2 mJ
dv/dt
Peak Diode Recovery dv/dt (Note 3) 20
V/ns
MOSFET dv/dt 100
P
D
Power Dissipation
(T
C
= 25
o
C) 216 W
- Derate Above 25
o
C1.72W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FCP25N60N_F102 Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 0.58
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 62.5
TO-220
G
D
S
G
S
D

Summary of content (8 pages)