Datasheet
December 2013
FCP4N60 — N-Channel SuperFET
®
MOSFET
©2008 Fairchild Semiconductor Corporation
FCP4N60 Rev. C1
www.fairchildsemi.com
1
FCP4N60
N-Channel SuperFET
®
MOSFET
600 V, 3.9 A, 1.2 Ω
Features
•650 V @ T
J
= 150°C
•
Typ. R
DS(on)
= 1.0 Ω
• Ultra Low Gate Charge (Typ. Q
g
= 12.8 nC)
• Low Effective Output Capacitance (Typ. C
oss(eff.)
= 32 pF)
• 100% Avalanche Tested
•RoHS Compliant
Application
• LCD / LED / PDP TV and Monitor Lighting
•
Solar Inverter
•
AC-DC Power Supply
Description
SuperFET
®
MOSFET is Fairchild Semiconductor’s first gener-
ation of high voltage super-junction (SJ) MOSFET family that is
utilizing charge balance technology for outstanding low on-
resistance and lower gate charge performance. This technology
is tailored to minimize conduction loss, provide superior switch-
ing performance, dv/dt rate and higher avalanche energy. Con-
sequently, SuperFET MOSFET is very suitable for the switching
power applications such as PFC, server/telecom power, FPD
TV power, ATX power and industrial power applications.
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter
FCP4N60
Unit
R
θJC
Thermal Resistance, Junction to Case, Max.
2.5
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 83
TO-220
G
D
S
Symbol Parameter FCP4N60 Unit
V
DSS
Drain-Source Voltage 600 V
I
D
Drain Current - Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C)
3.9
2.5
A
A
I
DM
Drain Current - Pulsed
(Note 1)
11.7
A
V
GSS
Gate-Source voltage ± 30 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
128 mJ
I
AR
Avalanche Current
(Note 1)
3.9 A
E
AR
Repetitive Avalanche Energy
(Note 1)
5.0 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
4.5 V/ns
P
D
Power Dissipation
(T
C
= 25°C)
- Derate Above 25°C
50
0.4
W
W/°C
T
J,
T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering,
1/8” from Case for 5 Seconds.
300 °C
G
S
D