Datasheet
December 2013
FCP190N60E / FCPF190N60E — N-Channel SuperFET
®
II Easy-Drive MOSFET
©2011 Fairchild Semiconductor Corporation
FCP190N60E / FCPF190N60E Rev. C10
www.fairchildsemi.com
1
FCP190N60E / FCPF190N60E
N-Channel SuperFET
®
II Easy-Drive MOSFET
600 V, 20.6 A, 190 mΩ
Features
•650 V @ T
J
= 150°C
•Typ. R
DS(on)
= 160 mΩ
• Ultra Low Gate Charge (Typ. Q
g
= 63 nC)
• Low Effective Output Capacitance (Typ. C
oss(eff.)
= 178 pF)
• 100% Avalanche Tested
• An Integrated Gate Resistor
•RoHS Compliant
Applications
• LCD / LED / PDP TV Lighting
• Solar Inverter
• AC-DC Power Supply
Description
SuperFET
®
II MOSFET is Fairchild Semiconductor’s brand-new
high voltage super-junction (SJ) MOSFET family that is utilizing
charge balance technology for outstanding low on-resistance
and lower gate charge performance. This technology is tailored
to minimize conduction loss, provide superior switching perfor-
mance, dv/dt rate and higher avalanche energy. Consequently,
SuperFET II MOSFET easy-drive series offers slightly slower
rise and fall times compared to the SuperFET II MOSFET
series. Noted by the "E" part number suffix, this family helps
manage EMI issues and allows for easier design implementa-
tion. For faster switching in applications where switching losses
must be at an absolute minimum, please consider the Super-
FET II MOSFET series.
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
*Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol Parameter FCP190N60E FCPF190N60E Unit
V
DSS
Drain to Source Voltage 600 V
V
GSS
Gate to Source Voltage
- DC ±20 V
- AC (f > 1 Hz) ±30 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 20.6 20.6*
A
- Continuous (T
C
= 100
o
C) 13.1 13.1*
I
DM
Drain Current - Pulsed (Note 1) 61.8 61.8* A
E
AS
Single Pulsed Avalanche Energy (Note 2) 400 mJ
I
AR
Avalanche Current (Note 1) 4.0 A
E
AR
Repetitive Avalanche Energy (Note 1) 2.1 mJ
dv/dt
MOSFET dv/dt 100
V/ns
Peak Diode Recovery dv/dt (Note 3) 20
P
D
Power Dissipation
(T
C
= 25
o
C) 208 39 W
- Derate Above 25
o
C 1.67 0.31 W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter
FCP190N60E FCPF190N60E
Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 0.6 3.2
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 62.5 62.5
TO-220
G
D
S
TO-220F
G
D
S
G
S
D