Datasheet
November 2013
FDA20N50F — N-Channel UniFET
TM
FRFET
®
MOSFET
©2007 Fairchild Semiconductor Corporation
FDA20N50F Rev. C1
www.fairchildsemi.com
1
FDA20N50F
N-Channel UniFET
TM
FRFET
®
MOSFET
500 V, 22 A, 260 m
Features
•R
DS(on)
= 220 m (Typ.) @ V
GS
= 10 V, I
D
= 11 A
• Low Gate Charge (Typ. 50 nC)
• Low C
rss
(Typ. 27 pF)
• 100% Avalanche Tested
• Improved dv/dt Capability
• RoHS Compliant
Applications
•PDP TV
• Uninterruptible Power Supply
• AC-DC Power Supply
Description
UniFET
TM
MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche
energy strength. The body diode’s reverse recovery perfor-
mance of UniFET FRFET
®
MOSFET has been enhanced by life-
time control. Its trr is less than 100nsec and the reverse dv/dt
immunity is 15V/ns while normal planar MOSFETs have over
200nsec and 4.5V/nsec respectively. Therefore, it can remove
additional component and improve system reliability in certain
applications in which the performance of MOSFET’s body diode
is significant. This device family is suitable for switching power
converter applications such as power factor correction (PFC),
flat panel display (FPD) TV power, ATX and electronic lamp bal-
lasts.
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDA20N50F Unit
V
DSS
Drain to Source Voltage 500 V
V
GSS
Gate to Source Voltage ±30 V
I
D
D r a i n C u r r e n t
- Continuous (T
C
= 25
o
C) 22
A
- Continuous (T
C
= 100
o
C) 13
I
DM
D r a i n C u r r e n t - P u l s e d (Note 1) 88 A
E
AS
Single Pulsed Avalanche Energy (Note 2) 1110 mJ
I
AR
Avalanche Current (Note 1) 22 A
E
AR
Repetitive Avalanche Energy (Note 1) 39 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 388 W
- Derate above 25
o
C3.1W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FDA20N50F Unit
R
JC
Thermal Resistance, Junction to Case, Max. 0.44
o
C/W
R
JA
Thermal Resistance, Junction to Ambient, Max. 40
TO-3PN
G
D
S
G
S
D