Datasheet
April 2014
FDA59N25 — N-Channel UniFET
TM
MOSFET
©2005 Fairchild Semiconductor Corporation
FDA59N25 Rev. C2
www.fairchildsemi.com
1
FDA59N25
N-Channel UniFET
TM
MOSFET
250 V, 59 A, 49 mΩ
Features
•R
DS(on)
= 49 mΩ (Max.) @ V
GS
= 10 V, I
D
= 29.5 A
• Low Gate Charge (Typ. 63 nC)
•Low C
rss
(Typ. 70 pF)
• 100% Avalanche Tested
•RoHS Compliant
Applications
•PDP TV
• Uninterruptible Power Supply
• AC-DC Power Supply
Description
UniFET
TM
MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche
energy strength. This device family is suitable for switching
power converter applications such as power factor correction
(PFC), flat panel display (FPD) TV power, ATX and electronic
lamp ballasts.
TO-3PN
G
D
S
G
S
D
Absolute Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDA59N25 Unit
V
DSS
Drain to Source Voltage 250 V
V
DS(Avalanche)
Repetitive Avalanche Voltage (Note 1,2) 300 V
V
GSS
Gate to Source Voltage ±30 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 59
A
- Continuous (T
C
= 100
o
C) 35
I
DM
Drain Current - Pulsed (Note 1) 236 A
E
AS
Single Pulsed Avalanche Energy (Note 2) 1458 mJ
I
AR
Avalanche Current (Note 1) 59 A
E
AR
Repetitive Avalanche Energy (Note 1) 39.2 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 392 W
- Derate Above 25
o
C3.2W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FDA59N25 Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 0.32
o
C/WR
θCS
Thermal Resistance, Case to Sink, Typ. 0.24
R
θJA
Thermal Resistance, Junction to Ambient, Max. 40