Datasheet
January 2014
FDD390N15ALZ — N-Channel PowerTrench
®
MOSFET
©2012 Fairchild Semiconductor Corporation
FDD390N15ALZ Rev. C4
www.fairchildsemi.com
1
FDD390N15ALZ
N-Channel PowerTrench
®
MOSFET
150 V, 26 A, 42 m
Features
•R
DS(on)
= 33.4 m (Typ.) @ V
GS
= 10 V, I
D
= 26 A
•R
DS(on)
= 42.2 m (Typ.) @ V
GS
= 4.5 V, I
D
= 20 A
• Fast Switching Speed
• Low Gate Charge, Q
G
= 17.6 nC (Typ.)
• High Performance Trench Technology for Extremely Low
R
DS(on)
• High Power and Current Handling Capability
•RoHS Compliant
Description
This N-Channel MOSFET is produced using Fairchild Semicon-
ductor’s advanced PowerTrench
®
process that has been tai-
lored to minimize the on-state resistance while maintaining
superior switching performance.
Applications
• Consumer Applicances
•LED TV
• Synchronous Rectification
• Uninterruptible Power Supplies
• Micro Solar Inverter
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDD390N15ALZ Unit
V
DSS
Drain to Source Voltage 150 V
V
GSS
Gate to Source Voltage ±20 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 26
A
- Continuous (T
C
= 100
o
C) 17
I
DM
Drain Current - Pulsed (Note 1) 104 A
E
AS
Single Pulsed Avalanche Energy (Note 2) 96 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 13 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 63 W
- Derate Above 25
o
C0.5W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter
FDD390N15ALZ
Unit
R
JC
Thermal Resistance, Junction to Case, Max. 2.0
o
C/W
R
JA
Thermal Resistance, Junction to Ambient, Max. 87
D-PAK
G
S
D
G
D
S