Datasheet

November 2013
FDD5N50NZF — N-Channel UniFET
TM
FRFET
®
MOSFET
©209 Fairchild Semiconductor Corporation
FDD5N50NZF Rev. C1
www.fairchildsemi.com
1
D-PAK
G
S
D
G
D
S
FDD5N50NZF
N-Channel UniFET
TM
FRFET
®
MOSFET
500 V, 3.7 A, 1.75 Ω
Features
•R
DS(on)
= 1.47 Ω (Typ.) @ V
GS
= 10 V, I
D
= 1.85 A
Low Gate Charge (Typ. 9 nC)
Low C
rss
(Typ. 4 pF)
100% Avalanche Tested
Improved dv/dt Capability
ESD Imoroved Capability
RoHS Compliant
Applications
LCD/LED/PDP TV
Lighting
Uninterruptible Power Supply
Description
UniFET
TM
II MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on advanced planar stripe and DMOS
technology. This advanced MOSFET family has the smallest
on-state resistance among the planar MOSFET, and also pro-
vides superior switching performance and higher avalanche
energy strength. In addition, internal gate-source ESD diode
allows UniFET II MOSFET to withstand over 2kV HBM surge
stress. The body diode’s reverse recovery performance of
UniFET II FRFET
®
MOSFET has been enhanced by lifetime
control. Its t
rr
is less than 100nsec and the reverse dv/dt immu-
nity is 15V/ns while normal planar MOSFETs have over
200nsec and 4.5V/nsec respectively. Therefore, it can remove
additional component and improve system reliability in certain
applications in which the performance of MOSFET’s body diode
is significant. This device family is suitable for switching power
converter applications such as power factor correction (PFC),
flat panel display (FPD) TV power, ATX and electronic lamp bal-
lasts.
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDD5N50NZFTM Unit
V
DSS
Drain to Source Voltage 500 V
V
GSS
Gate to Source Voltage ±25 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 3.7
A
- Continuous (T
C
= 100
o
C) 2.2
I
DM
Drain Current - Pulsed (Note 1) 14 A
E
AS
Single Pulsed Avalanche Energy (Note 2) 165 mJ
I
AR
Avalanche Current (Note 1) 3.3 A
E
AR
Repetitive Avalanche Energy (Note 1) 6.25 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 20 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 62.5 W
- Derate Above 25
o
C0.5W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter
FDD5N50NZFTM
Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 2
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 62.5

Summary of content (8 pages)