Datasheet
November 2013
FDD6N50 / FDU6N50 — N-Channel UniFET
TM
MOSFET
©2006 Fairchild Semiconductor Corporation
FDD6N50 / FDU6N50 Rev. C1
www.fairchildsemi.com
1
FDD6N50 / FDU6N50
N-Channel UniFET
TM
MOSFET
500 V, 6 A, 900 mΩ
Features
•R
DS(on)
= 900 mΩ (Max.) @ V
GS
= 10 V, I
D
= 3 A
• Low Gate Charge (Typ. 12.8 nC)
•Low C
rss
(Typ. 9 pF)
• 100% Avalanche Tested
• Improved dv/dt Capability
Applications
• LCD/LED/PDP TV
• Lighting
• Uninterruptible Power Supply
• AC-DC Power Supply
Description
UniFET
TM
MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche
energy strength. This device family is suitable for switching
power converter applications such as power factor correction
(PFC), flat panel display (FPD) TV power, ATX and electronic
lamp ballasts.
G
D
S
I-PAK
D-PAK
G
S
D
G
S
D
Absolute Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter
FDD6N50TM /
FDD6N50TM_WS /
FDU6N50TU Unit
V
DSS
Drain-Source Voltage 500 V
I
D
Drain Current - Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C)
6
3.8
A
A
I
DM
Drain Current - Pulsed
(Note 1)
24 A
V
GSS
Gate-Source voltage ±30 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
270 mJ
I
AR
Avalanche Current
(Note 1)
6A
E
AR
Repetitive Avalanche Energy
(Note 1)
8.9 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
4.5 V/ns
P
D
Power Dissipation (T
C
= 25°C)
- Derate Above 25°C
89
0.71
W
W/°C
T
J,
T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for
5 Seconds
300 °C
Symbol Parameter
FDD6N50TM /
FDD6N50TM_WS /
FDU6N50TU Unit
R
θJC
Thermal Resistance, Junction-to-Case, Max. 1.4
°C/W
R
θJA
Thermal Resistance, Junction-to-Ambient, Max. 83