Datasheet
November 2013
FDD7N20TM — N-Channel UniFET
TM
MOSFET
©2007 Fairchild Semiconductor Corporation
FDD7N20TM Rev. C1
www.fairchildsemi.com
1
FDD7N20TM
N-Channel UniFET
TM
MOSFET
200 V, 5 A, 690 mΩ
Features
•R
DS(on)
= 580 mΩ (Typ.) @ V
GS
= 10 V, I
D
= 2.5 A
• Low Gate Charge (Typ. 5 nC)
• Low C
rss
(Typ. 5 pF)
• 100% Avalanche Tested
• RoHS Compliant
Applications
• LCD/LED/PDP TV
• Consumer Appliances
• Lighting
• Uninterruptible Power
• AC-DC Power Supply
Description
UniFET
TM
MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche en-
ergy strength. This device family is suitable for switching power
converter applications such as power factor correction (PFC),
flat panel display (FPD) TV power, ATX and electronic lamp bal-
lasts.
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDD7N20TM Unit
V
DSS
Drain to Source Voltage 200 V
V
GSS
Gate to Source Voltage ±30 V
I
D
D r a i n C u r r e n t
- Continuous (T
C
= 25
o
C) 5
A
- Continuous (T
C
= 100
o
C) 3
I
DM
D r a i n C u r r e n t - P u l s e d (Note 1) 15 A
E
AS
Single Pulsed Avalanche Energy (Note 2) 62.5 mJ
I
AR
Avalanche Current (Note 1) 5 A
E
AR
Repetitive Avalanche Energy (Note 1) 4.3 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 43 W
- Derate Above 25
o
C0.34W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FDD7N20TM Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 2.9
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 110
D-PAK
G
S
D
G
S
D