Datasheet
November 2013
FDH45N50F — N-Channel UniFET
TM
FRFET
®
MOSFET
©2008 Fairchild Semiconductor Corporation
FDH45N50F Rev. C1
www.fairchildsemi.com
1
FDH45N50F
N-Channel UniFET
TM
FRFET
®
MOSFET
500 V, 45 A, 120 mΩ
Features
•R
DS(on)
= 105 mΩ (Typ.) @ V
GS
= 10 V, I
D
= 22.5 A
• Low Gate Charge (Typ. 105 nC)
• Low C
rss
(Typ. 62 pF)
• 100% Avalanche Tested
• Improved dv/dt Capability
Applications
• Lighting
• Uninterruptible Power Supply
• AC-DC Power Supply
Description
UniFET
TM
MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche en-
ergy strength. The body diode’s reverse recovery performance
of UniFET FRFET
®
MOSFET has been enhanced by lifetime
control. Its t
rr
is less than 100nsec and the reverse dv/dt immuni-
ty is 15V/ns while normal planar MOSFETs have over 200nsec
and 4.5V/nsec respectively. Therefore, it can remove additional
component and improve system reliability in certain applications
in which the performance of MOSFET’s body diode is significant.
This device family is suitable for switching power converter ap-
plications such as power factor correction (PFC), flat panel dis-
play (FPD) TV power, ATX and electronic lamp ballasts
G
D
S
TO-247
G
S
D
Absolute Maximum Ratings T
C
= 25°C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDH45N50F_F133 Unit
V
DSS
Drain-Source Voltage 500 V
I
D
Drain Current - Continuous (T
C
= 25°C)
- Continuous (T
C
= 100°C)
45
28.4
A
A
I
DM
Drain Current - Pulsed
(Note 1)
180 A
V
GSS
Gate-Source voltage ±30 V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
1868 mJ
I
AR
Avalanche Current
(Note 1)
45 A
E
AR
Repetitive Avalanche Energy
(Note 1)
62.5 mJ
dv/dt Peak Diode Recovery dv/dt
(Note 3)
50 V/ns
P
D
Power Dissipation (T
C
= 25°C)
- Derate Above 25°C
625
5
W
W/°C
T
J,
T
STG
Operating and Storage Temperature Range -55 to +150 °C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds 300 °C
Symbol Parameter FDH45N50F_F133 Unit
R
θJC
Thermal Resistance, Junction-to-Case, Max. 0.2
°C/W
R
θJA
Thermal Resistance, Junction-to-Ambient, Max. 40