Datasheet

June 2014
©2012 Fairchild Semiconductor Corporation
FDMC8622 Rev.C6
www.fairchildsemi.com
1
FDMC8622 N-Channel Shielded Gate PowerTrench
®
MOSFET
FDMC8622
N-Channel Shielded Gate PowerTrench
®
MOSFET
100 V, 16 A, 56 mΩ
Features
Shielded Gate MOSFET Technology
Max r
DS(on)
= 56 mΩ at V
GS
= 10 V, I
D
= 4 A
Max r
DS(on)
= 90 mΩ at V
GS
= 6 V, I
D
= 3 A
High performance trench technology for extremely low r
DS(on)
High power and current handling capability in a widely used
surface mount package
100% UIL Tested
Termination is Lead-free and RoHS Compliant
General Description
This N-Channel MOSFET is produced using Fairchild
Semiconductor‘s advanced PowerTrench
®
process that
incorporates Shielded Gate technology. This process has been
optimized for
r
DS(on)
, switching performance and ruggedness.
Application
DC-DC Primary Switch
MLP 3.3X3.3
S
S
S
G
D
D
D
D
1234
5
DDDD
G
SSS
Bottom
Top
678
MOSFET Maximum Ratings T
A
= 25 °C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units
V
DS
Drain to Source Voltage 100 V
V
GS
Gate to Source Voltage ±20 V
I
D
Drain Current -Continuous T
C
= 25 °C 16
A -Continuous T
A = 25 °C (Note 1a) 4
-Pulsed (Note 4) 30
E
AS
Single Pulse Avalanche Energy (Note 3) 37 mJ
P
D
Power Dissipation T
C
= 25 °C 31
W
Power Dissipation T
A
= 25 °C (Note 1a) 2.3
T
J
, T
STG
Operating and Storage Junction Temperature Range -55 to +150 °C
R
θJC
Thermal Resistance, Junction to Case (Note 1) 4.0
°C/W
R
θJA
Thermal Resistance, Junction to Ambient (Note 1a) 53
Device Marking Device Package Reel Size Tape Width Quantity
FDMC8622 FDMC8622 MLP 3.3X3.3 13 ’’ 12 mm 3000 units

Summary of content (7 pages)