Datasheet

FDME510PZT P-Channel PowerTrench
®
MOSFET
©2011 Fairchild Semiconductor Corporation
FDME510PZT Rev.C3
www.fairchildsemi.com
1
October 2013
FDME510PZT
P-Channel PowerTrench
®
MOSFET
-20 V, -6 A, 37 mΩ
Features
Max r
DS(on)
= 37 mΩ at V
GS
= -4.5 V, I
D
= -5 A
Max r
DS(on)
= 50 mΩ at V
GS
= -2.5 V, I
D
= -4 A
Max r
DS(on)
= 65 mΩ at V
GS
= -1.8 V, I
D
= -3 A
Max r
DS(on)
= 100 mΩ at V
GS
= -1.5 V, I
D
= -2 A
Low profile: 0.55 mm maximum in the new package
MicroFET 1.6x1.6 Thin
Free from halogenated compounds and antimony oxides
HBM ESD protection level > 2400V (Note3)
RoHS Compliant
General Description
This device is designed specifically for battery charging or load
switching in cellular handset and other ultraportable applications.
It features a MOSFET with low on-state resistance.
The MicroFET 1.6x1.6 Thin package offers exceptional thermal
performance for its physical size and is well suited to switching
and linear mode applications.
MicroFET 1.6x1.6 Thin
G
D
D
TOP
BOTTOM
Pin 1
D
G
D
S
D
D
S
D
D
S
MOSFET Maximum Ratings T
A
= 25 °C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units
V
DS
Drain to Source Voltage -20 V
V
GS
Gate to Source Voltage ±8 V
I
D
Drain Current -Continuous T
A
= 25 °C (Note 1a) -6
A
-Pulsed -15
P
D
Power Dissipation for Single Operation T
A
= 25 °C (Note 1a) 2.1
W
Power Dissipation for Single Operation T
A
= 25 °C (Note 1b) 0.7
T
J
, T
STG
Operating and Storage Junction Temperature Range -55 to +150 °C
R
θJA
Thermal Resistance, Junction to Ambient (Note 1a) 60
°C/W
R
θJA
Thermal Resistance, Junction to Ambient (Note 1b) 175
Device Marking Device Package Reel Size Tape Width Quantity
7T FDME510PZT MicroFET 1.6x1.6 Thin 7 ’’ 8 mm 5000 units

Summary of content (7 pages)