Datasheet
October 2013
©2012 Fairchild Semiconductor Corporation
FDME820NZT Rev.C2
www.fairchildsemi.com
1
FDME820NZT N-Channel PowerTrench
®
MOSFET
FDME820NZT
N-Channel PowerTrench
®
MOSFET
20 V, 9 A, 18 mΩ
Features
Max r
DS(on)
= 18 mΩ at V
GS
= 4.5 V, I
D
= 9 A
Max r
DS(on)
= 24 mΩ at V
GS
= 2.5 V, I
D
= 7.5 A
Max r
DS(on)
= 32 mΩ at V
GS
= 1.8 V, I
D
= 7 A
Low profile: 0.55 mm maximum in the new package
MicroFET 1.6x1.6 Thin
Free from halogenated compounds and antimony oxides
HBM ESD protection level >2.5 kV (Note3)
RoHS Compliant
General Description
This Single N-Channel MOSFET has been designed using
Fairchild Semiconductor’s advanced Power Trench process to
optimize the r
DS(ON)
@ VGS = 1.8 V on special MicroFET
leadframe.
Applications
Li-lon Battery Pack
Baseband Switch
Load Switch
DC-DC Conversion
MicroFET 1.6x1.6 Thin
G
D
D
TOP
BOTTOM
Pin 1
D
G
D
S
D
D
S
D
D
S
MOSFET Maximum Ratings T
A
= 25 °C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units
V
DS
Drain to Source Voltage 20 V
V
GS
Gate to Source Voltage ±12 V
I
D
Drain Current -Continuous T
A
= 25 °C (Note 1a) 9
A
-Pulsed 40
P
D
Power Dissipation for Single Operation T
A
= 25 °C (Note 1a) 2.1
W
Power Dissipation for Single Operation T
A
= 25 °C (Note 1b) 0.7
T
J
, T
STG
Operating and Storage Junction Temperature Range -55 to +150 °C
R
θJA
Thermal Resistance, Junction to Ambient (Note 1a) 70
°C/W
R
θJA
Thermal Resistance, Junction to Ambient (Note 1b) 190
Device Marking Device Package Reel Size Tape Width Quantity
8T FDME820NZT MicroFET 1.6x1.6 Thin 7 ’’ 8 mm 5000 units