Datasheet

October 2013
©2011 Fairchild Semiconductor Corporation
FDME905PT Rev.C4
www.fairchildsemi.com
1
FDME905PT P-Channel PowerTrench
®
MOSFET
FDME905PT
P-Channel PowerTrench
®
MOSFET
-12 V, -8 A, 22 mΩ
Features
Max r
DS(on)
= 22 mΩ at V
GS
= -4.5 V, I
D
= -8 A
Max r
DS(on)
= 26 mΩ at V
GS
= -2.5 V, I
D
= -7.3 A
Max r
DS(on)
= 97 mΩ at V
GS
= -1.8 V, I
D
= -3.8 A
Low profile: 0.55 mm maximum in the new package
MicroFET 1.6x1.6 Thin
Free from halogenated compounds and antimony oxides
RoHS Compliant
General Description
This device is designed specifically for battery charging or load
switching in cellular handset and other ultraportable applications.
It features a MOSFET with low on-state resistance.
The MicroFET 1.6x1.6 Thin package offers exceptional thermal
performance for its physical size and is well suited to switching
and linear mode applications.
MicroFET 1.6x1.6 Thin
G
D
D
TOP BOTTOM
Pin 1
D
G
D
S
D
D
S
D
D
5
1
6
2
3
4
Bottom Drain Contact
S
MOSFET Maximum Ratings T
A
= 25 °C unless otherwise noted
Thermal Characteristics
Package Marking and Ordering Information
Symbol Parameter Ratings Units
V
DS
Drain to Source Voltage -12 V
V
GS
Gate to Source Voltage ±8 V
I
D
Drain Current -Continuous T
A
= 25 °C (Note 1a) -8
A
-Pulsed -30
P
D
Power Dissipation T
A
= 25 °C (Note 1a) 2.1
W
Power Dissipation T
A
= 25 °C (Note 1b) 0.7
T
J
, T
STG
Operating and Storage Junction Temperature Range -55 to +150 °C
R
θJC
Thermal Resistance, Junction to Case 4.5
°C/WR
θJA
Thermal Resistance, Junction to Ambient (Note 1a) 60
R
θJA
Thermal Resistance, Junction to Ambient (Note 1b) 175
Device Marking Device Package Reel Size Tape Width Quantity
E95 FDME905PT MicroFET 1.6x1.6 Thin 7 ’’ 8 mm 5000 units