Datasheet

November 2013
FDP19N40 — N-Channel UniFET
TM
MOSFET
©2012 Fairchild Semiconductor Corporation
FDP19N40 Rev. C1
www.fairchildsemi.com
1
FDP19N40
N-Channel UniFET
TM
MOSFET
400 V, 19 A, 240 mΩ
Features
•R
DS(on)
= 200 mΩ (Typ.) @ V
GS
= 10 V, I
D
= 9.5 A
Low Gate Charge (Typ. 32 nC)
•Low C
rss
(Typ. 20 pF)
100% Avalanche Tested
Improved dv/dt Capability
•RoHS Compliant
Applications
Lighting
Uninterruptible Power Supply
AC-DC Power Supply
Description
UniFET
TM
MOSFET is Fairchild Semiconductor’s high voltage
MOSFET family based on planar stripe and DMOS technology.
This MOSFET is tailored to reduce on-state resistance, and to
provide better switching performance and higher avalanche
energy strength. This device family is suitable for switching
power converter applications such as power factor correction
(PFC), flat panel display (FPD) TV power, ATX and electronic
lamp ballasts.
TO-220
G
D
S
G
S
D
MOSFET Maximum Ratings T
C
= 25
o
C unless otherwise noted.
Thermal Characteristics
Symbol Parameter FDP19N40 Unit
V
DSS
Drain to Source Voltage 400 V
V
GSS
Gate to Source Voltage ±30 V
I
D
Drain Current
- Continuous (T
C
= 25
o
C) 19
A
- Continuous (T
C
= 100
o
C) 11.4
I
DM
Drain Current - Pulsed (Note 1) 76 A
E
AS
Single Pulsed Avalanche Energy (Note 2) 542 mJ
I
AR
Avalanche Current (Note 1) 19 A
E
AR
Repetitive Avalanche Energy (Note 1) 21.5 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 15 V/ns
P
D
Power Dissipation
(T
C
= 25
o
C) 215 W
- Derate Above 25
o
C1.65W/
o
C
T
J
, T
STG
Operating and Storage Temperature Range -55 to +150
o
C
T
L
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds
300
o
C
Symbol Parameter FDP19N40 Unit
R
θJC
Thermal Resistance, Junction to Case, Max. 0.6
o
C/W
R
θJA
Thermal Resistance, Junction to Ambient, Max. 62.5

Summary of content (8 pages)